Graphene encapsulating boron nitride electrostatic assemblies for fabrication of polymer composites with high thermal conductivity

Abstract

In the recent years, significant attention has been focused in insulating electronic encapsulation materials with high thermal conductivity. We fabricated reduced graphene oxide (RGO) encapsulated h-BN hybrids (h-BN@RGO) from the thermal reduction of electrostatically assembled h-BN@GO hybrids. It is found that the addition of h-BN@RGO fillers enhances the thermal conductivity of epoxy resins while preserving the electrical insulation. The thermal conductivity achieve 3.45 W.m-1.K-1, by adding 40 wt% h-BN@RGO, which is enhanced by 1643% compared with that of neat epoxy.