File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Dynamic scaling phenomena and universality classes in growth of iron nitride thin films deposited by direct current magnetron sputtering

TitleDynamic scaling phenomena and universality classes in growth of iron nitride thin films deposited by direct current magnetron sputtering
Authors
KeywordsDynamic scaling phenomena
Growth mechanism
Nitrides
Sputtering
Issue Date2005
Citation
Thin Solid Films, 2005, v. 492, n. 1-2, p. 75-78 How to Cite?
AbstractIn this paper, dynamic scaling approach has been used to investigate the growth of iron nitride films, which were deposited by direct current magnetron sputtering using an Ar/N2 gas mixture (N2/(N2 + Ar) = 30%) at room temperature and 250 °C substrate temperature. The structure of the deposited films was determined by using X-ray diffraction. The perpendicular fluctuations in the height h (x, t) of the surface were analyzed by atomic force microscopy and grazing incidence X-ray scattering in the light of dynamical scaling approach, and the two dependent nontrivial exponents, roughness exponent α and growth exponent β, were determined. For the iron nitride films grown at room temperature and 250 °C, α = 0.39 ± 0.01 and 0.30 ± 0.02 and β = 0.29 ± 0.03 and 0.28 ± 0.07, respectively, which were in agreement with a type of universality that was suggested by Kardar, Parisi and Zhang. It might be concluded that it was desorption rather than the surface diffusion that dominated the relaxation process in both the case of room and higher substrate temperatures for the deposition of iron nitride thin films. © 2005 Elsevier B.V. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/335733
ISSN
2023 Impact Factor: 2.0
2023 SCImago Journal Rankings: 0.400
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorWang, X.-
dc.contributor.authorZheng, W. T.-
dc.contributor.authorWang, L. L.-
dc.contributor.authorTian, H. W.-
dc.contributor.authorYu, S. S.-
dc.contributor.authorMeng, F. L.-
dc.contributor.authorLi, X. T.-
dc.contributor.authorKong, X. G.-
dc.date.accessioned2023-12-28T08:48:21Z-
dc.date.available2023-12-28T08:48:21Z-
dc.date.issued2005-
dc.identifier.citationThin Solid Films, 2005, v. 492, n. 1-2, p. 75-78-
dc.identifier.issn0040-6090-
dc.identifier.urihttp://hdl.handle.net/10722/335733-
dc.description.abstractIn this paper, dynamic scaling approach has been used to investigate the growth of iron nitride films, which were deposited by direct current magnetron sputtering using an Ar/N2 gas mixture (N2/(N2 + Ar) = 30%) at room temperature and 250 °C substrate temperature. The structure of the deposited films was determined by using X-ray diffraction. The perpendicular fluctuations in the height h (x, t) of the surface were analyzed by atomic force microscopy and grazing incidence X-ray scattering in the light of dynamical scaling approach, and the two dependent nontrivial exponents, roughness exponent α and growth exponent β, were determined. For the iron nitride films grown at room temperature and 250 °C, α = 0.39 ± 0.01 and 0.30 ± 0.02 and β = 0.29 ± 0.03 and 0.28 ± 0.07, respectively, which were in agreement with a type of universality that was suggested by Kardar, Parisi and Zhang. It might be concluded that it was desorption rather than the surface diffusion that dominated the relaxation process in both the case of room and higher substrate temperatures for the deposition of iron nitride thin films. © 2005 Elsevier B.V. All rights reserved.-
dc.languageeng-
dc.relation.ispartofThin Solid Films-
dc.subjectDynamic scaling phenomena-
dc.subjectGrowth mechanism-
dc.subjectNitrides-
dc.subjectSputtering-
dc.titleDynamic scaling phenomena and universality classes in growth of iron nitride thin films deposited by direct current magnetron sputtering-
dc.typeArticle-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.tsf.2005.06.058-
dc.identifier.scopuseid_2-s2.0-25644438307-
dc.identifier.volume492-
dc.identifier.issue1-2-
dc.identifier.spage75-
dc.identifier.epage78-
dc.identifier.isiWOS:000232592100014-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats