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Article: Enhanced tensile ductility of tungsten microwires via high-density dislocations and reduced grain boundaries

TitleEnhanced tensile ductility of tungsten microwires via high-density dislocations and reduced grain boundaries
Authors
KeywordsDislocation
Ductility
Grain boundary
In situ TEM
Nanomechanics
Tungsten
Issue Date2021
Citation
Journal of Materials Science and Technology, 2021, v. 95, p. 193-202 How to Cite?
AbstractDespite being strong with many outstanding physical properties, tungsten is inherently brittle at room temperature, restricting its structural and functional applications at small scales. Here, a facile strategy has been adopted, to introduce high-density dislocations while reducing grain boundaries, through electron backscatter diffraction (EBSD)-guided microfabrication of cold-drawn bulk tungsten wires. The designed tungsten microwire attains an ultralarge uniform tensile elongation of ~10.6%, while retains a high yield strength of ~2.4 GPa. in situ TEM tensile testing reveals that the large uniform elongation of tungsten microwires originates from the motion of pre-existing high-density dislocations, while the subsequent ductile fracture is attributed to crack-tip plasticity and the inhibition of grain boundary cracking. This work demonstrates the application potential of tungsten microcomponents with superior ductility and workability for micro/nanoscale mechanical, electronic, and energy systems.
Persistent Identifierhttp://hdl.handle.net/10722/326285
ISSN
2023 Impact Factor: 11.2
2023 SCImago Journal Rankings: 2.309
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorDang, Chaoqun-
dc.contributor.authorLin, Weitong-
dc.contributor.authorMeng, Fanling-
dc.contributor.authorZhang, Hongti-
dc.contributor.authorFan, Sufeng-
dc.contributor.authorLi, Xiaocui-
dc.contributor.authorCao, Ke-
dc.contributor.authorYang, Haokun-
dc.contributor.authorZhou, Wenzhao-
dc.contributor.authorFan, Zhengjie-
dc.contributor.authorKai, Ji jung-
dc.contributor.authorLu, Yang-
dc.date.accessioned2023-03-09T09:59:29Z-
dc.date.available2023-03-09T09:59:29Z-
dc.date.issued2021-
dc.identifier.citationJournal of Materials Science and Technology, 2021, v. 95, p. 193-202-
dc.identifier.issn1005-0302-
dc.identifier.urihttp://hdl.handle.net/10722/326285-
dc.description.abstractDespite being strong with many outstanding physical properties, tungsten is inherently brittle at room temperature, restricting its structural and functional applications at small scales. Here, a facile strategy has been adopted, to introduce high-density dislocations while reducing grain boundaries, through electron backscatter diffraction (EBSD)-guided microfabrication of cold-drawn bulk tungsten wires. The designed tungsten microwire attains an ultralarge uniform tensile elongation of ~10.6%, while retains a high yield strength of ~2.4 GPa. in situ TEM tensile testing reveals that the large uniform elongation of tungsten microwires originates from the motion of pre-existing high-density dislocations, while the subsequent ductile fracture is attributed to crack-tip plasticity and the inhibition of grain boundary cracking. This work demonstrates the application potential of tungsten microcomponents with superior ductility and workability for micro/nanoscale mechanical, electronic, and energy systems.-
dc.languageeng-
dc.relation.ispartofJournal of Materials Science and Technology-
dc.subjectDislocation-
dc.subjectDuctility-
dc.subjectGrain boundary-
dc.subjectIn situ TEM-
dc.subjectNanomechanics-
dc.subjectTungsten-
dc.titleEnhanced tensile ductility of tungsten microwires via high-density dislocations and reduced grain boundaries-
dc.typeArticle-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.jmst.2021.04.021-
dc.identifier.scopuseid_2-s2.0-85107782458-
dc.identifier.volume95-
dc.identifier.spage193-
dc.identifier.epage202-
dc.identifier.isiWOS:000733965200010-

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