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Article: Nanostructured copper filaments in electrochemical deposition

TitleNanostructured copper filaments in electrochemical deposition
Authors
Issue Date2001
Citation
Physical Review Letters, 2001, v. 86, n. 17, p. 3827-3830 How to Cite?
AbstractThe formation of a unique copper electrodeposit from an ultrathin film system was followed. The chemical compositions along the structured filament were observed. Further, the mechanism of this unusual growth behavior was established.
Persistent Identifierhttp://hdl.handle.net/10722/310357
ISSN
2023 Impact Factor: 8.1
2023 SCImago Journal Rankings: 3.040
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorWang, Mu-
dc.contributor.authorZhong, Sheng-
dc.contributor.authorYin, Xiao Bo-
dc.contributor.authorZhu, Jian Ming-
dc.contributor.authorPeng, Ru Wen-
dc.contributor.authorWang, Yuan-
dc.contributor.authorZhang, Ke Qin-
dc.contributor.authorMing, Nai Ben-
dc.date.accessioned2022-01-31T06:04:41Z-
dc.date.available2022-01-31T06:04:41Z-
dc.date.issued2001-
dc.identifier.citationPhysical Review Letters, 2001, v. 86, n. 17, p. 3827-3830-
dc.identifier.issn0031-9007-
dc.identifier.urihttp://hdl.handle.net/10722/310357-
dc.description.abstractThe formation of a unique copper electrodeposit from an ultrathin film system was followed. The chemical compositions along the structured filament were observed. Further, the mechanism of this unusual growth behavior was established.-
dc.languageeng-
dc.relation.ispartofPhysical Review Letters-
dc.titleNanostructured copper filaments in electrochemical deposition-
dc.typeArticle-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1103/PhysRevLett.86.3827-
dc.identifier.scopuseid_2-s2.0-0035937985-
dc.identifier.volume86-
dc.identifier.issue17-
dc.identifier.spage3827-
dc.identifier.epage3830-
dc.identifier.isiWOS:000168338300033-

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