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- Publisher Website: 10.1103/PhysRevMaterials.2.113401
- Scopus: eid_2-s2.0-85060645732
- WOS: WOS:000450572100002
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Article: Solid-state dewetting on curved substrates
Title | Solid-state dewetting on curved substrates |
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Authors | |
Issue Date | 2018 |
Citation | Physical Review Materials, 2018, v. 2, n. 11, article no. 113401 How to Cite? |
Abstract | Based on the thermodynamic variation to the free-energy functional, we propose a sharp-interface model for simulating solid-state dewetting of thin films on rigid curved substrates in two dimensions. This model describes the interface evolution which occurs through surface diffusion-controlled mass transport and contact point migration along the curved substrate. Furthermore, the surface energy anisotropy is easily included into the model, and the contact point migration is explicitly described by the relaxed contact angle boundary condition. We implement the mathematical model by a semi-implicit parametric finite-element method to study several interesting phenomena, such as "small" particle migration on curved substrates and templated solid-state dewetting on a prepatterned substrate. Based on ample numerical simulations, we demonstrate that, the migration velocity of a small solid particle is proportional to the substrate curvature gradient κ′ and inversely proportional to the square root of the area of the particle A, and it decreases when the isotropic Young's angle θi increases. In addition, we also observe four periodic categories of dewetting on a prepatterned sinusoidal substrate. Our approach can provide a convenient and powerful tool for exploring how to produce well-organized nanoparticles by making use of template-assisted solid-state dewetting. |
Description | Accepted manuscript is available on the publisher website. |
Persistent Identifier | http://hdl.handle.net/10722/303591 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Jiang, Wei | - |
dc.contributor.author | Wang, Yan | - |
dc.contributor.author | Srolovitz, David J. | - |
dc.contributor.author | Bao, Weizhu | - |
dc.date.accessioned | 2021-09-15T08:25:37Z | - |
dc.date.available | 2021-09-15T08:25:37Z | - |
dc.date.issued | 2018 | - |
dc.identifier.citation | Physical Review Materials, 2018, v. 2, n. 11, article no. 113401 | - |
dc.identifier.uri | http://hdl.handle.net/10722/303591 | - |
dc.description | Accepted manuscript is available on the publisher website. | - |
dc.description.abstract | Based on the thermodynamic variation to the free-energy functional, we propose a sharp-interface model for simulating solid-state dewetting of thin films on rigid curved substrates in two dimensions. This model describes the interface evolution which occurs through surface diffusion-controlled mass transport and contact point migration along the curved substrate. Furthermore, the surface energy anisotropy is easily included into the model, and the contact point migration is explicitly described by the relaxed contact angle boundary condition. We implement the mathematical model by a semi-implicit parametric finite-element method to study several interesting phenomena, such as "small" particle migration on curved substrates and templated solid-state dewetting on a prepatterned substrate. Based on ample numerical simulations, we demonstrate that, the migration velocity of a small solid particle is proportional to the substrate curvature gradient κ′ and inversely proportional to the square root of the area of the particle A, and it decreases when the isotropic Young's angle θi increases. In addition, we also observe four periodic categories of dewetting on a prepatterned sinusoidal substrate. Our approach can provide a convenient and powerful tool for exploring how to produce well-organized nanoparticles by making use of template-assisted solid-state dewetting. | - |
dc.language | eng | - |
dc.relation.ispartof | Physical Review Materials | - |
dc.title | Solid-state dewetting on curved substrates | - |
dc.type | Article | - |
dc.description.nature | link_to_OA_fulltext | - |
dc.identifier.doi | 10.1103/PhysRevMaterials.2.113401 | - |
dc.identifier.scopus | eid_2-s2.0-85060645732 | - |
dc.identifier.volume | 2 | - |
dc.identifier.issue | 11 | - |
dc.identifier.spage | article no. 113401 | - |
dc.identifier.epage | article no. 113401 | - |
dc.identifier.eissn | 2475-9953 | - |
dc.identifier.isi | WOS:000450572100002 | - |