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- Publisher Website: 10.1016/j.jmps.2008.12.001
- Scopus: eid_2-s2.0-61549134215
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Article: Molecular dynamics investigation of patterning via cold welding
Title | Molecular dynamics investigation of patterning via cold welding |
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Authors | |
Keywords | Fracture Adhesion Molecular dynamics Patterning Thin film |
Issue Date | 2009 |
Citation | Journal of the Mechanics and Physics of Solids, 2009, v. 57, n. 4, p. 776-787 How to Cite? |
Abstract | We perform a series of molecular dynamics simulations of a subtractive cold-welding patterning process. The effects of film thickness and work of adhesion between the thin film and substrate are examined. For small works of adhesion, the film elastically debonds from the substrate before the onset of plastic deformation inside the film during stamp retraction. A simple model is proposed to describe the debonding and deformation of the film. The model provides an analytical framework that describes the playoff between adhesion, yield strength, and film thickness in determining the debond length of the film induced by stamp retraction. © 2008 Elsevier Ltd. All rights reserved. |
Persistent Identifier | http://hdl.handle.net/10722/303342 |
ISSN | 2023 Impact Factor: 5.0 2023 SCImago Journal Rankings: 1.632 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Song, Jun | - |
dc.contributor.author | Srolovitz, David J. | - |
dc.date.accessioned | 2021-09-15T08:25:07Z | - |
dc.date.available | 2021-09-15T08:25:07Z | - |
dc.date.issued | 2009 | - |
dc.identifier.citation | Journal of the Mechanics and Physics of Solids, 2009, v. 57, n. 4, p. 776-787 | - |
dc.identifier.issn | 0022-5096 | - |
dc.identifier.uri | http://hdl.handle.net/10722/303342 | - |
dc.description.abstract | We perform a series of molecular dynamics simulations of a subtractive cold-welding patterning process. The effects of film thickness and work of adhesion between the thin film and substrate are examined. For small works of adhesion, the film elastically debonds from the substrate before the onset of plastic deformation inside the film during stamp retraction. A simple model is proposed to describe the debonding and deformation of the film. The model provides an analytical framework that describes the playoff between adhesion, yield strength, and film thickness in determining the debond length of the film induced by stamp retraction. © 2008 Elsevier Ltd. All rights reserved. | - |
dc.language | eng | - |
dc.relation.ispartof | Journal of the Mechanics and Physics of Solids | - |
dc.subject | Fracture | - |
dc.subject | Adhesion | - |
dc.subject | Molecular dynamics | - |
dc.subject | Patterning | - |
dc.subject | Thin film | - |
dc.title | Molecular dynamics investigation of patterning via cold welding | - |
dc.type | Article | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1016/j.jmps.2008.12.001 | - |
dc.identifier.scopus | eid_2-s2.0-61549134215 | - |
dc.identifier.volume | 57 | - |
dc.identifier.issue | 4 | - |
dc.identifier.spage | 776 | - |
dc.identifier.epage | 787 | - |
dc.identifier.isi | WOS:000264960700008 | - |