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Conference Paper: Asperity contact evolution: Capillarity and electromigration effects

TitleAsperity contact evolution: Capillarity and electromigration effects
Authors
Issue Date2004
Citation
Proceedings of the ASME/STLE International Joint Tribology Conference, IJTC 2004, 2004, n. PART A, p. 33-35 How to Cite?
AbstractThe evolution of an idealized asperity under the action of both capillarity and electromigration was studied. In this study, the acatual random distribution of asperity contacts along the surfaces with a periodic arrangement of identical contacts were replaced. The evolution of the asperity contact morphology was modeled within the framework of the phase field model. It was observed that if the voltage is increased, then the electromigration will dominate the evolution of the contact morphology.
Persistent Identifierhttp://hdl.handle.net/10722/303245

 

DC FieldValueLanguage
dc.contributor.authorKim, Ji Hee-
dc.contributor.authorCha, Pil Ryung-
dc.contributor.authorSrolovitz, David J.-
dc.date.accessioned2021-09-15T08:24:55Z-
dc.date.available2021-09-15T08:24:55Z-
dc.date.issued2004-
dc.identifier.citationProceedings of the ASME/STLE International Joint Tribology Conference, IJTC 2004, 2004, n. PART A, p. 33-35-
dc.identifier.urihttp://hdl.handle.net/10722/303245-
dc.description.abstractThe evolution of an idealized asperity under the action of both capillarity and electromigration was studied. In this study, the acatual random distribution of asperity contacts along the surfaces with a periodic arrangement of identical contacts were replaced. The evolution of the asperity contact morphology was modeled within the framework of the phase field model. It was observed that if the voltage is increased, then the electromigration will dominate the evolution of the contact morphology.-
dc.languageeng-
dc.relation.ispartofProceedings of the ASME/STLE International Joint Tribology Conference, IJTC 2004-
dc.titleAsperity contact evolution: Capillarity and electromigration effects-
dc.typeConference_Paper-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1115/TRIB2004-64336-
dc.identifier.scopuseid_2-s2.0-21244493676-
dc.identifier.issuePART A-
dc.identifier.spage33-
dc.identifier.epage35-

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