File Download
There are no files associated with this item.
Links for fulltext
(May Require Subscription)
- Publisher Website: 10.1109/JMEMS.2004.824889
- Scopus: eid_2-s2.0-1942468570
- WOS: WOS:000220759300024
- Find via
Supplementary
- Citations:
- Appears in Collections:
Article: Scaling laws for opening partially adhered contacts in MEMS
Title | Scaling laws for opening partially adhered contacts in MEMS |
---|---|
Authors | |
Keywords | Roughness Contact adhesion Detachment force |
Issue Date | 2004 |
Citation | Journal of Microelectromechanical Systems, 2004, v. 13, n. 2, p. 377-385 How to Cite? |
Abstract | MEMS switches represent a promising technology for a wide range of communications applications. They operate at high frequency, opening and closing the contact between metal pads. Surfaces are rough in nature, therefore a predictive description of contact switching requires understanding of asperity contact and adhesion. A simple model is presented to estimate adhesion forces in MEMS switches and the total forces required to detach the pads. The interface between two rigid pads is modeled as an array of uniformly distributed elastic asperities mimicking the interface roughness. Two types of asperities are considered: bonded asperities and adhered asperities, as described by the JKR adhesion model. The effects of asperity size, density, and load-displacement relationship are analyzed as a function of the loading conditions (i.e., tensile load and bending moment). The minimum force for detachment is proportional to the asperity size and asperity density, except when bending moments and tensile forces are combined (which leads to a more complex relationship). The results are summarized in a loading-detachment map. The most effective method to detach the contacts is through a combination of a bending moment and a tensile force. The implication of these results to MEMS designs are discussed and approaches to modifying the moment and tensile force ratio are suggested. |
Persistent Identifier | http://hdl.handle.net/10722/303241 |
ISSN | 2022 Impact Factor: 2.7 2020 SCImago Journal Rankings: 0.596 |
ISI Accession Number ID |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Decuzzi, Paolo | - |
dc.contributor.author | Srolovitz, David J. | - |
dc.date.accessioned | 2021-09-15T08:24:55Z | - |
dc.date.available | 2021-09-15T08:24:55Z | - |
dc.date.issued | 2004 | - |
dc.identifier.citation | Journal of Microelectromechanical Systems, 2004, v. 13, n. 2, p. 377-385 | - |
dc.identifier.issn | 1057-7157 | - |
dc.identifier.uri | http://hdl.handle.net/10722/303241 | - |
dc.description.abstract | MEMS switches represent a promising technology for a wide range of communications applications. They operate at high frequency, opening and closing the contact between metal pads. Surfaces are rough in nature, therefore a predictive description of contact switching requires understanding of asperity contact and adhesion. A simple model is presented to estimate adhesion forces in MEMS switches and the total forces required to detach the pads. The interface between two rigid pads is modeled as an array of uniformly distributed elastic asperities mimicking the interface roughness. Two types of asperities are considered: bonded asperities and adhered asperities, as described by the JKR adhesion model. The effects of asperity size, density, and load-displacement relationship are analyzed as a function of the loading conditions (i.e., tensile load and bending moment). The minimum force for detachment is proportional to the asperity size and asperity density, except when bending moments and tensile forces are combined (which leads to a more complex relationship). The results are summarized in a loading-detachment map. The most effective method to detach the contacts is through a combination of a bending moment and a tensile force. The implication of these results to MEMS designs are discussed and approaches to modifying the moment and tensile force ratio are suggested. | - |
dc.language | eng | - |
dc.relation.ispartof | Journal of Microelectromechanical Systems | - |
dc.subject | Roughness | - |
dc.subject | Contact adhesion | - |
dc.subject | Detachment force | - |
dc.title | Scaling laws for opening partially adhered contacts in MEMS | - |
dc.type | Article | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1109/JMEMS.2004.824889 | - |
dc.identifier.scopus | eid_2-s2.0-1942468570 | - |
dc.identifier.volume | 13 | - |
dc.identifier.issue | 2 | - |
dc.identifier.spage | 377 | - |
dc.identifier.epage | 385 | - |
dc.identifier.isi | WOS:000220759300024 | - |