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Conference Paper: Method of Selective Electroplating having Strong Adhesion and Exceptional Uniformity by Nanoparticle Immobilization

TitleMethod of Selective Electroplating having Strong Adhesion and Exceptional Uniformity by Nanoparticle Immobilization
Authors
Feng, SPT
Issue Date2012
Citation
The Minerals, Metals & Materials Society (TMS 2012) 141st Annual Meeting & Exhibition: Linking Science and Technology for Global Solutions, Orlando, FL, 11-15 March 2012 How to Cite?
DescriptionInvited Lecture - Symposium: Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XI
Persistent Identifierhttp://hdl.handle.net/10722/270616

 

DC FieldValueLanguage
dc.contributor.authorFeng, SPT-
dc.date.accessioned2019-05-31T07:07:30Z-
dc.date.available2019-05-31T07:07:30Z-
dc.date.issued2012-
dc.identifier.citationThe Minerals, Metals & Materials Society (TMS 2012) 141st Annual Meeting & Exhibition: Linking Science and Technology for Global Solutions, Orlando, FL, 11-15 March 2012-
dc.identifier.urihttp://hdl.handle.net/10722/270616-
dc.descriptionInvited Lecture - Symposium: Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XI-
dc.languageeng-
dc.relation.ispartofThe Minerals, Metals & Materials Society (TMS) Annual Meeting & Exhibition-
dc.titleMethod of Selective Electroplating having Strong Adhesion and Exceptional Uniformity by Nanoparticle Immobilization-
dc.typeConference_Paper-
dc.identifier.emailFeng, SPT: hpfeng@hku.hk-
dc.identifier.authorityFeng, SPT=rp01533-
dc.identifier.hkuros205616-

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