File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Design and simulation of structure of micro thermal sensor device

TitleDesign and simulation of structure of micro thermal sensor device
Authors
KeywordsHeat rating
Thermal sensitive
SNR
Sensor
Issue Date2007
Citation
Hangkong Xuebao/Acta Aeronautica et Astronautica Sinica, 2007, v. 28, n. 2, p. 476-480 How to Cite?
AbstractThrough the investigations of the measurement method and the thermal balance of the micro thermal sensor device structure, it is improved to use the heat rating of each part of the device and the device signal to noise ratio (SNR) as the emulation and calculation goal to design the dimensions of the structure. Through vising ANSYS software analyzing the structure substrate with and without cavity and with vacuum cavity, comparing the calculation result of the heat rating of each part and device SNR in three cases, and analyzing different depths of vacuum cavity in the substrate, the optimization result of the micro thermal sensor device structure dimension is obtained.
Persistent Identifierhttp://hdl.handle.net/10722/265518
ISSN
2023 SCImago Journal Rankings: 0.397

 

DC FieldValueLanguage
dc.contributor.authorLiu, Kui-
dc.contributor.authorYuan, Wei Zheng-
dc.contributor.authorDeng, Jin Jun-
dc.contributor.authorMa, Bing He-
dc.contributor.authorJiang, Cheng Yu-
dc.date.accessioned2018-12-03T01:20:54Z-
dc.date.available2018-12-03T01:20:54Z-
dc.date.issued2007-
dc.identifier.citationHangkong Xuebao/Acta Aeronautica et Astronautica Sinica, 2007, v. 28, n. 2, p. 476-480-
dc.identifier.issn1000-6893-
dc.identifier.urihttp://hdl.handle.net/10722/265518-
dc.description.abstractThrough the investigations of the measurement method and the thermal balance of the micro thermal sensor device structure, it is improved to use the heat rating of each part of the device and the device signal to noise ratio (SNR) as the emulation and calculation goal to design the dimensions of the structure. Through vising ANSYS software analyzing the structure substrate with and without cavity and with vacuum cavity, comparing the calculation result of the heat rating of each part and device SNR in three cases, and analyzing different depths of vacuum cavity in the substrate, the optimization result of the micro thermal sensor device structure dimension is obtained.-
dc.languageeng-
dc.relation.ispartofHangkong Xuebao/Acta Aeronautica et Astronautica Sinica-
dc.subjectHeat rating-
dc.subjectThermal sensitive-
dc.subjectSNR-
dc.subjectSensor-
dc.titleDesign and simulation of structure of micro thermal sensor device-
dc.typeArticle-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.scopuseid_2-s2.0-34249845704-
dc.identifier.volume28-
dc.identifier.issue2-
dc.identifier.spage476-
dc.identifier.epage480-
dc.identifier.issnl1000-6893-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats