Microstructural characterization in diffusion‐bonded SiC/Ti–6Al–4V composites

Abstract

The microstructural evolution during the diffusion bonding consolidation of a Ti–6Al–4V/SiC fibre composite was investigated by optical, scanning and transmission electron microscopy. The effects of processing parameters, particularly temperature, on the microstructures of the matrix and the fibre and their bonding were considered. Processing at too high a temperature can result in growth of SiC crystals in the fibre in addition to rapid interfacial reaction, while interfacial bonding cannot be established if the temperature is too low. Various defects can be caused by inadequate fabrication practices. These include micro‐pores, matrix‐cracking, cracking, bending and impingement of fibres, and heterogeneous fibre distribution. Methods for avoiding these are discussed. A defect‐free and uniformly distributed fibre composite can only be achieved by optimizing the processing parameters (such as temperature, pressure, time and cooling rate) and adequately combining fibre spacing and matrix thickness with accurate fibre alignment. 1993 Blackwell Science Ltd