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Article: Quasicontinuum simulations of geometric effect on onset plasticity of nano-scale patterned lines
Title | Quasicontinuum simulations of geometric effect on onset plasticity of nano-scale patterned lines |
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Authors | |
Keywords | multiscale quasicontinuum method patterned line onset plasticity nanoindentation geometric effect |
Issue Date | 2017 |
Citation | Modelling and Simulation in Materials Science and Engineering, 2017, v. 25, n. 6, article no. 065012 How to Cite? |
Abstract | © 2017 IOP Publishing Ltd. Onset plasticity of metallic nano-lines or nano-beams is of considerable scientific and technological interest in micro-/nano- mechanics and interconnects of patterned lines in electronic devices, where capability of resistance to deformation is important. In this study, a multiscale quasicontinuum (QC) method was used to explore such an issue in a nano-scale copper (Cu) line protruding from a relatively large single crystal Cu substrate during compression. The results show that the yield stress of a rectangular beam on the substrate can be greatly reduced compared with that of a flat surface of the same area. For the rectangular line, the aspect ratio (width/height) affects dislocation morphology at the onset plasticity without much change of yield stress. However, for the trapezoidal line, the yield stress decreases with the base angle (α), especially when the α is over 54.7°. As the sidewall orientation changes from 100 at α = 0°, then to 111 at α = 54.7° and finally to 110 at α = 90°, a higher surface energy could enable easier dislocation formation and lower yield stress. Meanwhile, it is found that the interaction between the line and the support substrate also shows a great effect on yield stress. Moreover, although it is possible to open two extra dislocation slip planes inside from the two bottom corners of the Cu line with the α over 54.7°, dislocation nucleation derived from them is only observed at α = 90°. |
Persistent Identifier | http://hdl.handle.net/10722/262892 |
ISSN | 2021 Impact Factor: 2.421 2020 SCImago Journal Rankings: 0.687 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Jin, Jianfeng | - |
dc.contributor.author | Cao, Jingyi | - |
dc.contributor.author | Zhou, Siyuan | - |
dc.contributor.author | Yang, Peijun | - |
dc.contributor.author | Guo, Zhengxiao | - |
dc.date.accessioned | 2018-10-08T09:28:44Z | - |
dc.date.available | 2018-10-08T09:28:44Z | - |
dc.date.issued | 2017 | - |
dc.identifier.citation | Modelling and Simulation in Materials Science and Engineering, 2017, v. 25, n. 6, article no. 065012 | - |
dc.identifier.issn | 0965-0393 | - |
dc.identifier.uri | http://hdl.handle.net/10722/262892 | - |
dc.description.abstract | © 2017 IOP Publishing Ltd. Onset plasticity of metallic nano-lines or nano-beams is of considerable scientific and technological interest in micro-/nano- mechanics and interconnects of patterned lines in electronic devices, where capability of resistance to deformation is important. In this study, a multiscale quasicontinuum (QC) method was used to explore such an issue in a nano-scale copper (Cu) line protruding from a relatively large single crystal Cu substrate during compression. The results show that the yield stress of a rectangular beam on the substrate can be greatly reduced compared with that of a flat surface of the same area. For the rectangular line, the aspect ratio (width/height) affects dislocation morphology at the onset plasticity without much change of yield stress. However, for the trapezoidal line, the yield stress decreases with the base angle (α), especially when the α is over 54.7°. As the sidewall orientation changes from 100 at α = 0°, then to 111 at α = 54.7° and finally to 110 at α = 90°, a higher surface energy could enable easier dislocation formation and lower yield stress. Meanwhile, it is found that the interaction between the line and the support substrate also shows a great effect on yield stress. Moreover, although it is possible to open two extra dislocation slip planes inside from the two bottom corners of the Cu line with the α over 54.7°, dislocation nucleation derived from them is only observed at α = 90°. | - |
dc.language | eng | - |
dc.relation.ispartof | Modelling and Simulation in Materials Science and Engineering | - |
dc.subject | multiscale quasicontinuum method | - |
dc.subject | patterned line | - |
dc.subject | onset plasticity | - |
dc.subject | nanoindentation | - |
dc.subject | geometric effect | - |
dc.title | Quasicontinuum simulations of geometric effect on onset plasticity of nano-scale patterned lines | - |
dc.type | Article | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1088/1361-651X/aa70dc | - |
dc.identifier.scopus | eid_2-s2.0-85027237676 | - |
dc.identifier.volume | 25 | - |
dc.identifier.issue | 6 | - |
dc.identifier.spage | article no. 065012 | - |
dc.identifier.epage | article no. 065012 | - |
dc.identifier.eissn | 1361-651X | - |
dc.identifier.isi | WOS:000405087800001 | - |
dc.identifier.issnl | 0965-0393 | - |