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Article: Molecular Engineering of Platinum(II) Terpyridine Complexes with Tetraphenylethylene-Modified Alkynyl Ligands: Supramolecular Assembly via Pt···Pt and/or π–π Stacking Interactions and the Formation of Various Superstructures

TitleMolecular Engineering of Platinum(II) Terpyridine Complexes with Tetraphenylethylene-Modified Alkynyl Ligands: Supramolecular Assembly via Pt···Pt and/or π–π Stacking Interactions and the Formation of Various Superstructures
Authors
CHENG, HKYeung, CLMYam, VWW
Keywordsaggregation-induced emission
alkynyl ligands
platinum(II) terpyridine complexes
self-assembly
π-π interactions
Issue Date2017
PublisherAmerican Chemical Society. The Journal's web site is located at http://pubs.acs.org/journal/aamick
Citation
ACS Applied Materials & Interfaces, 2017, v. 9, p. 36220-36228 How to Cite?
DOI: http://dx.doi.org/10.1021/acsami.7b11807
Persistent Identifierhttp://hdl.handle.net/10722/252150
ISSN
1944-8244
2023 Impact Factor: 8.3
2023 SCImago Journal Rankings: 2.058
ISI Accession Number ID
WOS:000413503700074

 

DC FieldValueLanguage
dc.contributor.authorCHENG, HK-
dc.contributor.authorYeung, CLM-
dc.contributor.authorYam, VWW-
dc.date.accessioned2018-04-11T04:45:12Z-
dc.date.available2018-04-11T04:45:12Z-
dc.date.issued2017-
dc.identifier.citationACS Applied Materials & Interfaces, 2017, v. 9, p. 36220-36228-
dc.identifier.issn1944-8244-
dc.identifier.urihttp://hdl.handle.net/10722/252150-
dc.languageeng-
dc.publisherAmerican Chemical Society. The Journal's web site is located at http://pubs.acs.org/journal/aamick-
dc.relation.ispartofACS Applied Materials & Interfaces-
dc.subjectaggregation-induced emission-
dc.subjectalkynyl ligands-
dc.subjectplatinum(II) terpyridine complexes-
dc.subjectself-assembly-
dc.subjectπ-π interactions-
dc.titleMolecular Engineering of Platinum(II) Terpyridine Complexes with Tetraphenylethylene-Modified Alkynyl Ligands: Supramolecular Assembly via Pt···Pt and/or π–π Stacking Interactions and the Formation of Various Superstructures-
dc.typeArticle-
dc.identifier.emailYam, VWW: wwyam@hku.hk-
dc.identifier.authorityYam, VWW=rp00822-
dc.identifier.doi10.1021/acsami.7b11807-
dc.identifier.scopuseid_2-s2.0-85031711206-
dc.identifier.hkuros284644-
dc.identifier.volume9-
dc.identifier.spage36220-
dc.identifier.epage36228-
dc.identifier.isiWOS:000413503700074-
dc.publisher.placeUnited States-
dc.identifier.issnl1944-8244-

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