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- Publisher Website: 10.1016/j.jmps.2017.01.007
- Scopus: eid_2-s2.0-85012050546
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Article: Thermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds
Title | Thermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds |
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Authors | |
Keywords | Cohesive law Energy dissipation Molecular bond Peeling Rate dependence Thermal fluctuation |
Issue Date | 2017 |
Publisher | Elsevier Ltd. The Journal's web site is located at http://www.elsevier.com/locate/jmps |
Citation | Journal of the Mechanics and Physics of Solids, 2017, v. 101, p. 197-208 How to Cite? |
Persistent Identifier | http://hdl.handle.net/10722/248421 |
ISSN | 2023 Impact Factor: 5.0 2023 SCImago Journal Rankings: 1.632 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Qian, J | - |
dc.contributor.author | Lin, J | - |
dc.contributor.author | Xu, G-K | - |
dc.contributor.author | Lin, Y | - |
dc.contributor.author | Gao, H | - |
dc.date.accessioned | 2017-10-18T08:42:56Z | - |
dc.date.available | 2017-10-18T08:42:56Z | - |
dc.date.issued | 2017 | - |
dc.identifier.citation | Journal of the Mechanics and Physics of Solids, 2017, v. 101, p. 197-208 | - |
dc.identifier.issn | 0022-5096 | - |
dc.identifier.uri | http://hdl.handle.net/10722/248421 | - |
dc.language | eng | - |
dc.publisher | Elsevier Ltd. The Journal's web site is located at http://www.elsevier.com/locate/jmps | - |
dc.relation.ispartof | Journal of the Mechanics and Physics of Solids | - |
dc.rights | Posting accepted manuscript (postprint): © <year>. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/ | - |
dc.subject | Cohesive law | - |
dc.subject | Energy dissipation | - |
dc.subject | Molecular bond | - |
dc.subject | Peeling | - |
dc.subject | Rate dependence | - |
dc.subject | Thermal fluctuation | - |
dc.title | Thermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds | - |
dc.type | Article | - |
dc.identifier.email | Lin, Y: ylin@hkucc.hku.hk | - |
dc.identifier.authority | Lin, Y=rp00080 | - |
dc.identifier.doi | 10.1016/j.jmps.2017.01.007 | - |
dc.identifier.scopus | eid_2-s2.0-85012050546 | - |
dc.identifier.hkuros | 280630 | - |
dc.identifier.volume | 101 | - |
dc.identifier.spage | 197 | - |
dc.identifier.epage | 208 | - |
dc.identifier.isi | WOS:000398751200013 | - |
dc.publisher.place | United Kingdom | - |
dc.identifier.issnl | 0022-5096 | - |