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Article: H-matrix based finite-element-based thermal analysis for 3D ICs

TitleH-matrix based finite-element-based thermal analysis for 3D ICs
Authors
Chen, HBLi, YCTan, SXDHuang, XWang, HWong, N
KeywordsFinite element method
H-matrix
Integrated circuits
Thermal analysis
Issue Date2015
PublisherAssociation for Computing Machinery. The Journal's web site is located at http://todaes.acm.org
Citation
ACM Transactions on Design Automaticn of Electronic Systems, 2015, v. 20 n. 4, article no. 47, p. 47:1-25 How to Cite?
DOI: http://dx.doi.org/10.1145/2714563
Persistent Identifierhttp://hdl.handle.net/10722/216996
ISSN
1084-4309
2021 Impact Factor: 1.447
2020 SCImago Journal Rankings: 0.266
ISI Accession Number ID
WOS:000362344900001

 

DC FieldValueLanguage
dc.contributor.authorChen, HB-
dc.contributor.authorLi, YC-
dc.contributor.authorTan, SXD-
dc.contributor.authorHuang, X-
dc.contributor.authorWang, H-
dc.contributor.authorWong, N-
dc.date.accessioned2015-09-18T05:45:38Z-
dc.date.available2015-09-18T05:45:38Z-
dc.date.issued2015-
dc.identifier.citationACM Transactions on Design Automaticn of Electronic Systems, 2015, v. 20 n. 4, article no. 47, p. 47:1-25-
dc.identifier.issn1084-4309-
dc.identifier.urihttp://hdl.handle.net/10722/216996-
dc.languageeng-
dc.publisherAssociation for Computing Machinery. The Journal's web site is located at http://todaes.acm.org-
dc.relation.ispartofACM Transactions on Design Automaticn of Electronic Systems-
dc.rightsACM Transactions on Design Automaticn of Electronic Systems. Copyright © Association for Computing Machinery.-
dc.subjectFinite element method-
dc.subjectH-matrix-
dc.subjectIntegrated circuits-
dc.subjectThermal analysis-
dc.titleH-matrix based finite-element-based thermal analysis for 3D ICs-
dc.typeArticle-
dc.identifier.emailWong, N: nwong@eee.hku.hk-
dc.identifier.authorityWong, N=rp00190-
dc.identifier.doi10.1145/2714563-
dc.identifier.scopuseid_2-s2.0-84942906087-
dc.identifier.hkuros253237-
dc.identifier.volume20-
dc.identifier.issue4-
dc.identifier.spage47:1-
dc.identifier.epage47:25-
dc.identifier.isiWOS:000362344900001-
dc.publisher.placeUnited States-
dc.identifier.issnl1084-4309-

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