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- Publisher Website: 10.1039/c5nr00944h
- Scopus: eid_2-s2.0-84933544840
- PMID: 25959991
- WOS: WOS:000356862900009
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Article: An all-copper plasmonic sandwich system through directly depositing copper NPs on a CVD grown graphene/copper film and its application in SERS
Title | An all-copper plasmonic sandwich system through directly depositing copper NPs on a CVD grown graphene/copper film and its application in SERS |
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Authors | |
Issue Date | 2015 |
Publisher | RSC Publications. The Journal's web site is located at http://pubs.rsc.org/en/journals/journalissues/nr#!recentarticles&all |
Citation | Nanoscale, 2015, v. 7 n. 26, p. 11291-11299 How to Cite? |
Abstract | A simple, low-cost, all-copper sandwich system has been obtained through directly depositing Cu nanoparticles (NPs) onto a graphene sheet, which has already been grown on a Cu foil (Cu-NGF). The new design inherits two key advantages: (1) the materials of the NGF coupling system are composed of only cheaper Cu instead of Au and Ag, (2) direct fabrication of the system without transferring graphene will greatly lower the fabrication cost. More importantly, the Cu-NFG system shows a high sensitivity in surface-enhanced Raman scattering (SERS) with the highest enhancement factor (EF, over 1.89 × 10(7)) reported to date in Cu plasmonic systems. Experimental and theoretical results reveal that the strong EF is mainly because of the strong near-field coupling between Cu NPs and Cu films at the optimal angle of incidence, opening up a new route for Cu materials in SERS applications. |
Persistent Identifier | http://hdl.handle.net/10722/216952 |
ISSN | 2023 Impact Factor: 5.8 2023 SCImago Journal Rankings: 1.416 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Li, X | - |
dc.contributor.author | Ren, X | - |
dc.contributor.author | Zhang, Y | - |
dc.contributor.author | Choy, WCH | - |
dc.contributor.author | Wei, B | - |
dc.date.accessioned | 2015-09-18T05:43:58Z | - |
dc.date.available | 2015-09-18T05:43:58Z | - |
dc.date.issued | 2015 | - |
dc.identifier.citation | Nanoscale, 2015, v. 7 n. 26, p. 11291-11299 | - |
dc.identifier.issn | 2040-3364 | - |
dc.identifier.uri | http://hdl.handle.net/10722/216952 | - |
dc.description.abstract | A simple, low-cost, all-copper sandwich system has been obtained through directly depositing Cu nanoparticles (NPs) onto a graphene sheet, which has already been grown on a Cu foil (Cu-NGF). The new design inherits two key advantages: (1) the materials of the NGF coupling system are composed of only cheaper Cu instead of Au and Ag, (2) direct fabrication of the system without transferring graphene will greatly lower the fabrication cost. More importantly, the Cu-NFG system shows a high sensitivity in surface-enhanced Raman scattering (SERS) with the highest enhancement factor (EF, over 1.89 × 10(7)) reported to date in Cu plasmonic systems. Experimental and theoretical results reveal that the strong EF is mainly because of the strong near-field coupling between Cu NPs and Cu films at the optimal angle of incidence, opening up a new route for Cu materials in SERS applications. | - |
dc.language | eng | - |
dc.publisher | RSC Publications. The Journal's web site is located at http://pubs.rsc.org/en/journals/journalissues/nr#!recentarticles&all | - |
dc.relation.ispartof | Nanoscale | - |
dc.title | An all-copper plasmonic sandwich system through directly depositing copper NPs on a CVD grown graphene/copper film and its application in SERS | - |
dc.type | Article | - |
dc.identifier.email | Choy, WCH: chchoy@eee.hku.hk | - |
dc.identifier.authority | Choy, WCH=rp00218 | - |
dc.description.nature | link_to_OA_fulltext | - |
dc.identifier.doi | 10.1039/c5nr00944h | - |
dc.identifier.pmid | 25959991 | - |
dc.identifier.scopus | eid_2-s2.0-84933544840 | - |
dc.identifier.hkuros | 250870 | - |
dc.identifier.volume | 7 | - |
dc.identifier.issue | 26 | - |
dc.identifier.spage | 11291 | - |
dc.identifier.epage | 11299 | - |
dc.identifier.isi | WOS:000356862900009 | - |
dc.publisher.place | United Kingdom | - |
dc.identifier.issnl | 2040-3364 | - |