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Conference Paper: Density functional tight binding modeling in the context of ultra-thin SOI MOSFETs

TitleDensity functional tight binding modeling in the context of ultra-thin SOI MOSFETs
Authors
Issue Date2015
PublisherIEEE.
Citation
The 2015 International Workshop on Computational Electronics (IWCE), Lafayette, LA., 2-4 September 2015. How to Cite?
AbstractWe investigate the applicability of density functional tight binding (DFTB) theory [1][2], coupled to non-equilibrium Green functions (NEGF), for atomistic simulations of ultra-scaled electron devices, using the DFTB+ code [3][4]. In the context of ultra-thin silicon-on-insulator (SOI) transistors we adopt atomic models that include not only the Si channel, but also the interfacial SiO2, and look at the change of electronic, dielectric and transport properties as Si film thickness is reduced from 10 nm to less than 1 nm. We build on our previous reports [5][6], and draw a systematic comparison against a corresponding model that employs H-passivation of the channel, and against known experiment.
Persistent Identifierhttp://hdl.handle.net/10722/213649

 

DC FieldValueLanguage
dc.contributor.authorMarkov, SN-
dc.contributor.authorYam, CY-
dc.contributor.authorAradi, B-
dc.contributor.authorPenazzi, G-
dc.contributor.authorPecchia, A-
dc.contributor.authorFrauenheim, T-
dc.contributor.authorChen, G-
dc.date.accessioned2015-08-11T02:17:08Z-
dc.date.available2015-08-11T02:17:08Z-
dc.date.issued2015-
dc.identifier.citationThe 2015 International Workshop on Computational Electronics (IWCE), Lafayette, LA., 2-4 September 2015.-
dc.identifier.urihttp://hdl.handle.net/10722/213649-
dc.description.abstractWe investigate the applicability of density functional tight binding (DFTB) theory [1][2], coupled to non-equilibrium Green functions (NEGF), for atomistic simulations of ultra-scaled electron devices, using the DFTB+ code [3][4]. In the context of ultra-thin silicon-on-insulator (SOI) transistors we adopt atomic models that include not only the Si channel, but also the interfacial SiO2, and look at the change of electronic, dielectric and transport properties as Si film thickness is reduced from 10 nm to less than 1 nm. We build on our previous reports [5][6], and draw a systematic comparison against a corresponding model that employs H-passivation of the channel, and against known experiment.-
dc.languageeng-
dc.publisherIEEE.-
dc.relation.ispartofInternational Workshop on Computational Electronics (IWCE)-
dc.rightsInternational Workshop on Computational Electronics (IWCE). Copyright © IEEE.-
dc.rights©20xx IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.-
dc.titleDensity functional tight binding modeling in the context of ultra-thin SOI MOSFETs-
dc.typeConference_Paper-
dc.identifier.emailMarkov, SN: figaro@hku.hk-
dc.identifier.emailYam, CY: yamcy1@hku.hk-
dc.identifier.emailChen, G: ghchen@hku.hk-
dc.identifier.authorityYam, CY=rp01399-
dc.identifier.authorityChen, G=rp00671-
dc.identifier.hkuros247368-

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