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Patent History
- ApplicationHK 20100101798 2010-02-19
- GrantedHK 1135008 2012-11-02
Patent Family
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granted patent: SHAPE MEMORY LOCKING DEVICE FOR ORTHOPEDIC IMPLANTS
Title | SHAPE MEMORY LOCKING DEVICE FOR ORTHOPEDIC IMPLANTS |
---|---|
Granted Patent | HK 1135008 |
Granted Date | 2012-11-02 |
Priority Date | 2007-09-13 PCT/CN2007002710 2006-09-13 US 11/844237P |
Inventors | |
Issue Date | 2012 |
Citation | Hong Kong Patent HK 1135008. Hong Kong, PRC: Intellectual Property Office of the Governmemnt of the Hong Kong Special Administration Region, 2012 How to Cite? |
Abstract | A mechanism to connect the supporting portions of orthopaedic implants such as in the head, spine, upper limb and lower limb and thereby prevent loosening and fretting at the implant interface of an orthopaedic implant construct has been developed based on shape memory effect and super-elasticity of shape memory materials such as nickel-titanium (nitinol or NiTi) shape-memory-alloy, without the use of typical threaded fastening technique. Advantages are conferred by making the entire device, not just connecting pieces, out of shape memory alloy and having shape memory effect and super-elasticity. Heating the memory head of the device will compress the connection portion without the use of an auxiliary device (e.g. coupling member) so that the connection portion can be completely clamped down by the memory head.; Further advantages are provided through the use of a two-way shape memory effect in which the memory device can be closed or tightened by heating up the ambient temperature, and re-opened by cooling down the temperature. |
Persistent Identifier | http://hdl.handle.net/10722/210553 |
DC Field | Value | Language |
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dc.date.accessioned | 2015-06-17T07:04:38Z | - |
dc.date.available | 2015-06-17T07:04:38Z | - |
dc.date.issued | 2012 | - |
dc.identifier.citation | Hong Kong Patent HK 1135008. Hong Kong, PRC: Intellectual Property Office of the Governmemnt of the Hong Kong Special Administration Region, 2012 | - |
dc.identifier.uri | http://hdl.handle.net/10722/210553 | - |
dc.description.abstract | A mechanism to connect the supporting portions of orthopaedic implants such as in the head, spine, upper limb and lower limb and thereby prevent loosening and fretting at the implant interface of an orthopaedic implant construct has been developed based on shape memory effect and super-elasticity of shape memory materials such as nickel-titanium (nitinol or NiTi) shape-memory-alloy, without the use of typical threaded fastening technique. Advantages are conferred by making the entire device, not just connecting pieces, out of shape memory alloy and having shape memory effect and super-elasticity. Heating the memory head of the device will compress the connection portion without the use of an auxiliary device (e.g. coupling member) so that the connection portion can be completely clamped down by the memory head.; Further advantages are provided through the use of a two-way shape memory effect in which the memory device can be closed or tightened by heating up the ambient temperature, and re-opened by cooling down the temperature. | - |
dc.title | SHAPE MEMORY LOCKING DEVICE FOR ORTHOPEDIC IMPLANTS | - |
dc.type | Patent | - |
dc.identifier.authority | LU WEIJIA WILLIAM=rp00411 | - |
dc.identifier.authority | CHEUNG MAN CHEE KENNETH=rp00387 | - |
dc.identifier.authority | YEUNG WAI KWOK KELVIN=rp00309 | - |
dc.identifier.authority | LUK DIP KEI KEITH=rp00333 | - |
dc.contributor.inventor | CHEUNG MAN CHEE KENNETH | - |
dc.contributor.inventor | LUK DIP KEI KEITH | - |
dc.contributor.inventor | LU WEIJIA WILLIAM | - |
dc.contributor.inventor | YEUNG WAI KWOK KELVIN | - |
patents.identifier.application | HK 20100101798 | - |
patents.identifier.granted | HK 1135008 | - |
patents.description.assignee | UNIV HONG KONG [HK] | - |
patents.description.country | Hong Kong (S.A.R.) | - |
patents.date.granted | 2012-11-02 | - |
patents.identifier.hkutechid | O&T-2006-00209-2 | - |
patents.date.application | 2010-02-19 | - |
patents.date.priority | 2007-09-13 PCT/CN2007002710 | - |
patents.date.priority | 2006-09-13 US 11/844237P | - |
patents.description.cc | hk | - |
patents.relation.family | WO 2008043254 (A1) 2008-04-17 | - |
patents.relation.family | US 2008065074 (A1) 2008-03-13 | - |
patents.relation.family | EP 2077779 (A1) 2009-07-15 | - |
patents.relation.family | CN 101511291 (A) 2009-08-19 | - |
patents.relation.family | U S8444682 (B2) 2013-05-21 | - |
patents.description.kind | A1 | - |
patents.type | Patent_granted | - |