File Download

There are no files associated with this item.

  Patent History
  • Application
    HK 20100101798 2010-02-19
  • Granted
    HK 1135008 2012-11-02
Supplementary

granted patent: SHAPE MEMORY LOCKING DEVICE FOR ORTHOPEDIC IMPLANTS

TitleSHAPE MEMORY LOCKING DEVICE FOR ORTHOPEDIC IMPLANTS
Granted PatentHK 1135008
Granted Date2012-11-02
Priority Date2007-09-13 PCT/CN2007002710
2006-09-13 US 11/844237P
Inventors
Issue Date2012
Citation
Hong Kong Patent HK 1135008. Hong Kong, PRC: Intellectual Property Office of the Governmemnt of the Hong Kong Special Administration Region, 2012 How to Cite?
AbstractA mechanism to connect the supporting portions of orthopaedic implants such as in the head, spine, upper limb and lower limb and thereby prevent loosening and fretting at the implant interface of an orthopaedic implant construct has been developed based on shape memory effect and super-elasticity of shape memory materials such as nickel-titanium (nitinol or NiTi) shape-memory-alloy, without the use of typical threaded fastening technique. Advantages are conferred by making the entire device, not just connecting pieces, out of shape memory alloy and having shape memory effect and super-elasticity. Heating the memory head of the device will compress the connection portion without the use of an auxiliary device (e.g. coupling member) so that the connection portion can be completely clamped down by the memory head.; Further advantages are provided through the use of a two-way shape memory effect in which the memory device can be closed or tightened by heating up the ambient temperature, and re-opened by cooling down the temperature.
Persistent Identifierhttp://hdl.handle.net/10722/210553

 

DC FieldValueLanguage
dc.date.accessioned2015-06-17T07:04:38Z-
dc.date.available2015-06-17T07:04:38Z-
dc.date.issued2012-
dc.identifier.citationHong Kong Patent HK 1135008. Hong Kong, PRC: Intellectual Property Office of the Governmemnt of the Hong Kong Special Administration Region, 2012-
dc.identifier.urihttp://hdl.handle.net/10722/210553-
dc.description.abstractA mechanism to connect the supporting portions of orthopaedic implants such as in the head, spine, upper limb and lower limb and thereby prevent loosening and fretting at the implant interface of an orthopaedic implant construct has been developed based on shape memory effect and super-elasticity of shape memory materials such as nickel-titanium (nitinol or NiTi) shape-memory-alloy, without the use of typical threaded fastening technique. Advantages are conferred by making the entire device, not just connecting pieces, out of shape memory alloy and having shape memory effect and super-elasticity. Heating the memory head of the device will compress the connection portion without the use of an auxiliary device (e.g. coupling member) so that the connection portion can be completely clamped down by the memory head.; Further advantages are provided through the use of a two-way shape memory effect in which the memory device can be closed or tightened by heating up the ambient temperature, and re-opened by cooling down the temperature.-
dc.titleSHAPE MEMORY LOCKING DEVICE FOR ORTHOPEDIC IMPLANTS-
dc.typePatent-
dc.identifier.authorityLU WEIJIA WILLIAM=rp00411-
dc.identifier.authorityCHEUNG MAN CHEE KENNETH=rp00387-
dc.identifier.authorityYEUNG WAI KWOK KELVIN=rp00309-
dc.identifier.authorityLUK DIP KEI KEITH=rp00333-
dc.contributor.inventorCHEUNG MAN CHEE KENNETH-
dc.contributor.inventorLUK DIP KEI KEITH-
dc.contributor.inventorLU WEIJIA WILLIAM-
dc.contributor.inventorYEUNG WAI KWOK KELVIN-
patents.identifier.applicationHK 20100101798-
patents.identifier.grantedHK 1135008-
patents.description.assigneeUNIV HONG KONG [HK]-
patents.description.countryHong Kong (S.A.R.)-
patents.date.granted2012-11-02-
patents.identifier.hkutechidO&T-2006-00209-2-
patents.date.application2010-02-19-
patents.date.priority2007-09-13 PCT/CN2007002710-
patents.date.priority2006-09-13 US 11/844237P-
patents.description.cchk-
patents.relation.familyWO 2008043254 (A1) 2008-04-17-
patents.relation.familyUS 2008065074 (A1) 2008-03-13-
patents.relation.familyEP 2077779 (A1) 2009-07-15-
patents.relation.familyCN 101511291 (A) 2009-08-19-
patents.relation.familyU S8444682 (B2) 2013-05-21-
patents.description.kindA1-
patents.typePatent_granted-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats