File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Copper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materials

TitleCopper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materials
Authors
TANG, YChan, S-WShih, K
KeywordsCeramic materials
Electroplating sludge
Leaching
Rietveld refinement
Waterworks sludge
Issue Date2014
Citation
Waste Management, 2014, v. 34, p. 1085-1091 How to Cite?
DOI: http://dx.doi.org/10.1016/j.wasman.2013.07.001
Persistent Identifierhttp://hdl.handle.net/10722/202690
ISI Accession Number ID
WOS:000337208600018

 

DC FieldValueLanguage
dc.contributor.authorTANG, Yen_US
dc.contributor.authorChan, S-Wen_US
dc.contributor.authorShih, Ken_US
dc.date.accessioned2014-09-19T09:14:17Z-
dc.date.available2014-09-19T09:14:17Z-
dc.date.issued2014en_US
dc.identifier.citationWaste Management, 2014, v. 34, p. 1085-1091en_US
dc.identifier.urihttp://hdl.handle.net/10722/202690-
dc.languageengen_US
dc.relation.ispartofWaste Managementen_US
dc.subjectCeramic materials-
dc.subjectElectroplating sludge-
dc.subjectLeaching-
dc.subjectRietveld refinement-
dc.subjectWaterworks sludge-
dc.titleCopper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materialsen_US
dc.typeArticleen_US
dc.identifier.emailShih, K: kshih@hkucc.hku.hken_US
dc.identifier.authorityShih, K=rp00167en_US
dc.identifier.doi10.1016/j.wasman.2013.07.001-
dc.identifier.scopuseid_2-s2.0-84900542540-
dc.identifier.hkuros237121en_US
dc.identifier.volume34en_US
dc.identifier.spage1085en_US
dc.identifier.epage1091en_US
dc.identifier.isiWOS:000337208600018-

Export via OAI-PMH Interface in XML Formats

OR

Export to Other Non-XML Formats