Showing results 1 to 4 of 4
Title | Author(s) | Issue Date | |
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3-D measurement of solder paste using two-step phase shift profilometry Journal:IEEE Transactions on Electronics Packaging Manufacturing | 2008 | ||
3D profile reconstruction of solder paste based on phase shift profilometry Proceeding/Conference:IEEE International Conference on Industrial Informatics (INDIN) | 2007 | ||
Erratum: Solder paste inspection using region-based defect detection (International Journal of Advanced Manufacturing Technology DOI 10.1007/s00170-008-1639-6) Journal:International Journal of Advanced Manufacturing Technology | 2009 | ||
Solder paste inspection using region-based defect detection Journal:International Journal of Advanced Manufacturing Technology | 2009 |