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- Publisher Website: 10.1021/es400404x
- Scopus: eid_2-s2.0-84881446768
- WOS: WOS:000323013400065
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Article: Copper Sludge from Printed Circuit Board Production/Recycling for Ceramic Materials: A Quantitative Analysis of Copper Transformation and Immobilization
Title | Copper Sludge from Printed Circuit Board Production/Recycling for Ceramic Materials: A Quantitative Analysis of Copper Transformation and Immobilization |
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Authors | |
Issue Date | 2013 |
Citation | Environmental Science & Technology, 2013, v. 47, p. 8609–8615 How to Cite? |
Persistent Identifier | http://hdl.handle.net/10722/188931 |
ISSN | 2023 Impact Factor: 10.8 2023 SCImago Journal Rankings: 3.516 |
ISI Accession Number ID |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Tang, Y | en_US |
dc.contributor.author | Lee, PH | en_US |
dc.contributor.author | Shih, K | en_US |
dc.date.accessioned | 2013-09-17T14:20:57Z | - |
dc.date.available | 2013-09-17T14:20:57Z | - |
dc.date.issued | 2013 | en_US |
dc.identifier.citation | Environmental Science & Technology, 2013, v. 47, p. 8609–8615 | en_US |
dc.identifier.issn | 0013-936X | - |
dc.identifier.uri | http://hdl.handle.net/10722/188931 | - |
dc.language | eng | en_US |
dc.relation.ispartof | Environmental Science & Technology | en_US |
dc.title | Copper Sludge from Printed Circuit Board Production/Recycling for Ceramic Materials: A Quantitative Analysis of Copper Transformation and Immobilization | en_US |
dc.type | Article | en_US |
dc.identifier.email | Tang, Y: tangyuan@hku.hk | en_US |
dc.identifier.email | Shih, K: kshih@hkucc.hku.hk | en_US |
dc.identifier.authority | Shih, K=rp00167 | en_US |
dc.identifier.doi | 10.1021/es400404x | - |
dc.identifier.scopus | eid_2-s2.0-84881446768 | - |
dc.identifier.hkuros | 222360 | en_US |
dc.identifier.volume | 47 | en_US |
dc.identifier.spage | 8609 | en_US |
dc.identifier.epage | 8615 | en_US |
dc.identifier.eissn | 1520-5851 | - |
dc.identifier.isi | WOS:000323013400065 | - |
dc.identifier.issnl | 0013-936X | - |