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Conference Paper: New Low Modulus Bone Void Fillers For Osteoporotic Vertebral Fracture Fixation

TitleNew Low Modulus Bone Void Fillers For Osteoporotic Vertebral Fracture Fixation
Authors
Wong, HMChu, PKLuk, KDKCheung, KMCYeung, KWK
Issue Date2012
PublisherSociety for Biomaterials (SFB).
Citation
The 2012 Fall Symposium of the Society for Biomaterials, New Orleans, LA., 4-6 October 2012, abstract no. 172 How to Cite?
DescriptionConference theme: Grand Challenges in Biomaterials
Poster Session - Biomaterial Strategies for Tissue Integration and Regeneration 1
Persistent Identifierhttp://hdl.handle.net/10722/185035

 

DC FieldValueLanguage
dc.contributor.authorWong, HMen_US
dc.contributor.authorChu, PKen_US
dc.contributor.authorLuk, KDKen_US
dc.contributor.authorCheung, KMCen_US
dc.contributor.authorYeung, KWKen_US
dc.date.accessioned2013-07-15T10:25:26Z-
dc.date.available2013-07-15T10:25:26Z-
dc.date.issued2012en_US
dc.identifier.citationThe 2012 Fall Symposium of the Society for Biomaterials, New Orleans, LA., 4-6 October 2012, abstract no. 172en_US
dc.identifier.urihttp://hdl.handle.net/10722/185035-
dc.descriptionConference theme: Grand Challenges in Biomaterials-
dc.descriptionPoster Session - Biomaterial Strategies for Tissue Integration and Regeneration 1-
dc.languageengen_US
dc.publisherSociety for Biomaterials (SFB).-
dc.relation.ispartofSociety for Biomaterials Fall Symposiumen_US
dc.titleNew Low Modulus Bone Void Fillers For Osteoporotic Vertebral Fracture Fixationen_US
dc.typeConference_Paperen_US
dc.identifier.emailWong, HM: khmwong@hku.hken_US
dc.identifier.emailLuk, KDK: hcm21000@hku.hken_US
dc.identifier.emailCheung, KMC: cheungmc@hku.hken_US
dc.identifier.emailYeung, KWK: wkkyeung@hku.hken_US
dc.identifier.authorityLuk, KDK=rp00333en_US
dc.identifier.authorityCheung, KMC=rp00387en_US
dc.identifier.authorityYeung, KWK=rp00309en_US
dc.identifier.hkuros215906en_US
dc.publisher.placeUnited States-

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