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Article: A robust surface-integral-equation formulation for conductive media

TitleA robust surface-integral-equation formulation for conductive media
Authors
Chu, YHChew, WC
KeywordsConductive Media
Lossy Media
Skin Depth
Surface-Integral-Equation Method
Issue Date2005
PublisherJohn Wiley & Sons, Inc. The Journal's web site is located at http://www3.interscience.wiley.com/cgi-bin/jhome/37176
Citation
Microwave And Optical Technology Letters, 2005, v. 46 n. 2, p. 109-114 How to Cite?
DOI: http://dx.doi.org/10.1002/mop.20916
AbstractA novel surface-integral-equation (SIE) formulation is proposed by tuning the weighting coefficients for the external- and inter nal-region integral equations. Without increasing the computational cost, the present formulation significantly enlarges the solvable skin-depth range. © 2005 Wiley Periodicals, Inc.
Persistent Identifierhttp://hdl.handle.net/10722/182711
ISSN
0895-2477
2021 Impact Factor: 1.311
2020 SCImago Journal Rankings: 0.304
ISI Accession Number ID
WOS:000229736100005
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorChu, YHen_US
dc.contributor.authorChew, WCen_US
dc.date.accessioned2013-05-02T05:16:33Z-
dc.date.available2013-05-02T05:16:33Z-
dc.date.issued2005en_US
dc.identifier.citationMicrowave And Optical Technology Letters, 2005, v. 46 n. 2, p. 109-114en_US
dc.identifier.issn0895-2477en_US
dc.identifier.urihttp://hdl.handle.net/10722/182711-
dc.description.abstractA novel surface-integral-equation (SIE) formulation is proposed by tuning the weighting coefficients for the external- and inter nal-region integral equations. Without increasing the computational cost, the present formulation significantly enlarges the solvable skin-depth range. © 2005 Wiley Periodicals, Inc.en_US
dc.languageengen_US
dc.publisherJohn Wiley & Sons, Inc. The Journal's web site is located at http://www3.interscience.wiley.com/cgi-bin/jhome/37176en_US
dc.relation.ispartofMicrowave and Optical Technology Lettersen_US
dc.subjectConductive Mediaen_US
dc.subjectLossy Mediaen_US
dc.subjectSkin Depthen_US
dc.subjectSurface-Integral-Equation Methoden_US
dc.titleA robust surface-integral-equation formulation for conductive mediaen_US
dc.typeArticleen_US
dc.identifier.emailChew, WC: wcchew@hku.hken_US
dc.identifier.authorityChew, WC=rp00656en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1002/mop.20916en_US
dc.identifier.scopuseid_2-s2.0-23044444060en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-23044444060&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume46en_US
dc.identifier.issue2en_US
dc.identifier.spage109en_US
dc.identifier.epage114en_US
dc.identifier.isiWOS:000229736100005-
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridChu, YH=8688952100en_US
dc.identifier.scopusauthoridChew, WC=36014436300en_US
dc.identifier.issnl0895-2477-

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