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Article: Pressure and temperature changes of heat-cured acrylic resin during processing

TitlePressure and temperature changes of heat-cured acrylic resin during processing
Authors
KeywordsAcrylic resin
Boiling point
Dental materials
Monomer
Porosity
Pressure change
Temperature change
Issue Date2002
PublisherElsevier Inc. The Journal's web site is located at http://www.elsevier.com/locate/dental
Citation
Dental Materials, 2002, v. 18 n. 8, p. 622-629 How to Cite?
AbstractOBJECTIVES: The aims of this study were to measure the pressure and temperature changes of acrylic resin during processing, to record the highest temperature reached when fast cured in boiling water and to determine the elevated boiling point of monomer under high pressure. METHODS: A subminiature pressure transducer (temperature compensated to 94 degrees C) and a thermocouple were placed on the palate of a standardized maxillary complete denture base. A heat-cured resin (Trevalon C) was polymerized by a long heating cycle (72 degrees C for 6.5 h and 92 degrees C for 1.5 h). Recordings of pressure and temperature (n=6) were made at initial clamping of denture flasks and throughout the processing cycles of resin. The temperature of the resin was also monitored during a fast cycle, which was accomplished by placing the flask directly into boiling water for 40 min. RESULTS: The pressure of acrylic dough inside the clamped flask was initially 11.5 atm (SD=3.2) and reached a peak of 22.0 atm (SD=3.5) during the long heating cycle. The elevated boiling point of monomer at increased pressure was calculated to be about 193 degrees C (at 11.5 atm) and 228 degrees C (at 22.0 atm). These elevated boiling points are higher than the maximum temperature 131 degrees C (SD=6.6) reached during the fast curing cycle. No porosity was observed even in the denture bases heat-cured by the fast cycle. SIGNIFICANCE: The highest temperature reached by heating of resin during processing is well below the elevated boiling point of monomer. Monomer therefore does not boil in clamped denture flasks under sufficient pressure. Thus adequate clamp pressure prevents gaseous porosity irrespective of curing cycle used.
Persistent Identifierhttp://hdl.handle.net/10722/154215
ISSN
2023 Impact Factor: 4.6
2023 SCImago Journal Rankings: 1.186
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorYau, EWFen_US
dc.contributor.authorCheng, YYen_US
dc.contributor.authorClark, RKFen_US
dc.contributor.authorChow, TWen_US
dc.date.accessioned2012-08-08T08:23:55Z-
dc.date.available2012-08-08T08:23:55Z-
dc.date.issued2002en_US
dc.identifier.citationDental Materials, 2002, v. 18 n. 8, p. 622-629en_US
dc.identifier.issn0109-5641en_US
dc.identifier.urihttp://hdl.handle.net/10722/154215-
dc.description.abstractOBJECTIVES: The aims of this study were to measure the pressure and temperature changes of acrylic resin during processing, to record the highest temperature reached when fast cured in boiling water and to determine the elevated boiling point of monomer under high pressure. METHODS: A subminiature pressure transducer (temperature compensated to 94 degrees C) and a thermocouple were placed on the palate of a standardized maxillary complete denture base. A heat-cured resin (Trevalon C) was polymerized by a long heating cycle (72 degrees C for 6.5 h and 92 degrees C for 1.5 h). Recordings of pressure and temperature (n=6) were made at initial clamping of denture flasks and throughout the processing cycles of resin. The temperature of the resin was also monitored during a fast cycle, which was accomplished by placing the flask directly into boiling water for 40 min. RESULTS: The pressure of acrylic dough inside the clamped flask was initially 11.5 atm (SD=3.2) and reached a peak of 22.0 atm (SD=3.5) during the long heating cycle. The elevated boiling point of monomer at increased pressure was calculated to be about 193 degrees C (at 11.5 atm) and 228 degrees C (at 22.0 atm). These elevated boiling points are higher than the maximum temperature 131 degrees C (SD=6.6) reached during the fast curing cycle. No porosity was observed even in the denture bases heat-cured by the fast cycle. SIGNIFICANCE: The highest temperature reached by heating of resin during processing is well below the elevated boiling point of monomer. Monomer therefore does not boil in clamped denture flasks under sufficient pressure. Thus adequate clamp pressure prevents gaseous porosity irrespective of curing cycle used.en_US
dc.languageengen_US
dc.publisherElsevier Inc. The Journal's web site is located at http://www.elsevier.com/locate/dentalen_US
dc.relation.ispartofDental Materialsen_US
dc.subjectAcrylic resin-
dc.subjectBoiling point-
dc.subjectDental materials-
dc.subjectMonomer-
dc.subjectPorosity-
dc.subjectPressure change-
dc.subjectTemperature change-
dc.subject.meshTemperatureen_US
dc.subject.meshPressureen_US
dc.subject.meshPorosityen_US
dc.subject.meshPolymers - Chemistryen_US
dc.subject.meshPhysicochemical Phenomenaen_US
dc.subject.meshMethylmethacrylates - Chemistryen_US
dc.subject.meshAcrylic Resins - chemistryen_US
dc.subject.meshChemistry, Physicalen_US
dc.subject.meshDenture Basesen_US
dc.subject.meshDifferential Thermal Analysisen_US
dc.subject.meshMaterials Testingen_US
dc.titlePressure and temperature changes of heat-cured acrylic resin during processingen_US
dc.typeArticleen_US
dc.identifier.emailYau, EWF: eliyau@HKUCC.hku.hken_US
dc.identifier.emailCheng, YY: yycheng@hku.hk-
dc.identifier.emailChow, TW: twchow@hku.hk-
dc.identifier.authorityChow, TW=rp00009en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1016/S0109-5641(01)00092-6en_US
dc.identifier.pmid12385904en_US
dc.identifier.scopuseid_2-s2.0-0036885644en_US
dc.identifier.hkuros81787-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0036885644&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume18en_US
dc.identifier.issue8en_US
dc.identifier.spage622en_US
dc.identifier.epage629en_US
dc.identifier.isiWOS:000179320900009-
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridChow, TW=7203012369en_US
dc.identifier.scopusauthoridClark, RKF=7406318698en_US
dc.identifier.scopusauthoridCheng, YY=7404915200en_US
dc.identifier.scopusauthoridYau, WFE=7005822437en_US
dc.identifier.issnl0109-5641-

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