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Article: Daytime urban heat island effect in high-rise and high-density residential developments in Hong Kong

TitleDaytime urban heat island effect in high-rise and high-density residential developments in Hong Kong
Authors
KeywordsClose Structure
Daytime Urban Heat Island Effect (Uhi)
Design Variables
Hong Kong
Open Structure
Residential Development
Issue Date2004
PublisherElsevier SA. The Journal's web site is located at http://www.elsevier.com/locate/enbuild
Citation
Energy And Buildings, 2004, v. 36 n. 6, p. 525-534 How to Cite?
AbstractNearly 60% of electrical energy use in Hong Kong is for space conditioning during summer months. The paper investigates the impact of design-related variables on outdoor micro level daytime heat island effect in residential developments in Hong Kong. The paper hypothesizes that the differences in outdoor temperatures within and between residential developments can be explained by the impact of design-related variables on the overall environment. Case studies of three large housing estates reveal urban heat island effect (UHI) in the order of 1.5°C within an estate, and 1.0°C between estates. The results indicate that energy efficient designs can be achieved by manipulating surface albedo, sky view factor and total height to floor area ratio (building massing) while maximizing cross ventilation. © 2004 Elsevier B.V. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/149370
ISSN
2023 Impact Factor: 6.6
2023 SCImago Journal Rankings: 1.632
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorGiridharan, Ren_US
dc.contributor.authorGanesan, Sen_US
dc.contributor.authorLau, SSYen_US
dc.date.accessioned2012-06-26T05:52:37Z-
dc.date.available2012-06-26T05:52:37Z-
dc.date.issued2004en_US
dc.identifier.citationEnergy And Buildings, 2004, v. 36 n. 6, p. 525-534en_US
dc.identifier.issn0378-7788en_US
dc.identifier.urihttp://hdl.handle.net/10722/149370-
dc.description.abstractNearly 60% of electrical energy use in Hong Kong is for space conditioning during summer months. The paper investigates the impact of design-related variables on outdoor micro level daytime heat island effect in residential developments in Hong Kong. The paper hypothesizes that the differences in outdoor temperatures within and between residential developments can be explained by the impact of design-related variables on the overall environment. Case studies of three large housing estates reveal urban heat island effect (UHI) in the order of 1.5°C within an estate, and 1.0°C between estates. The results indicate that energy efficient designs can be achieved by manipulating surface albedo, sky view factor and total height to floor area ratio (building massing) while maximizing cross ventilation. © 2004 Elsevier B.V. All rights reserved.en_US
dc.languageengen_US
dc.publisherElsevier SA. The Journal's web site is located at http://www.elsevier.com/locate/enbuilden_US
dc.relation.ispartofEnergy and Buildingsen_US
dc.subjectClose Structureen_US
dc.subjectDaytime Urban Heat Island Effect (Uhi)en_US
dc.subjectDesign Variablesen_US
dc.subjectHong Kongen_US
dc.subjectOpen Structureen_US
dc.subjectResidential Developmenten_US
dc.titleDaytime urban heat island effect in high-rise and high-density residential developments in Hong Kongen_US
dc.typeArticleen_US
dc.identifier.emailLau, SSY:ssylau@hku.hken_US
dc.identifier.authorityLau, SSY=rp01006en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1016/j.enbuild.2003.12.016en_US
dc.identifier.scopuseid_2-s2.0-2342448443en_US
dc.identifier.hkuros108240-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-2342448443&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume36en_US
dc.identifier.issue6en_US
dc.identifier.spage525en_US
dc.identifier.epage534en_US
dc.identifier.isiWOS:000221857700005-
dc.publisher.placeSwitzerlanden_US
dc.identifier.scopusauthoridGiridharan, R=7801607708en_US
dc.identifier.scopusauthoridGanesan, S=7102439694en_US
dc.identifier.scopusauthoridLau, SSY=24734045900en_US
dc.identifier.issnl0378-7788-

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