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postgraduate thesis: Variational analysis for 3D integrated circuit on-chip structures based on process-variation-aware electromagnetic-semiconductor coupledsimulation

TitleVariational analysis for 3D integrated circuit on-chip structures based on process-variation-aware electromagnetic-semiconductor coupledsimulation
Authors
Advisors
Advisor(s):Wong, NJiang, L
Issue Date2011
PublisherThe University of Hong Kong (Pokfulam, Hong Kong)
Citation
Xu, Y. [徐远哲]. (2011). Variational analysis for 3D integrated circuit on-chip structures based on process-variation-aware electromagnetic-semiconductor coupled simulation. (Thesis). University of Hong Kong, Pokfulam, Hong Kong SAR. Retrieved from http://dx.doi.org/10.5353/th_b4704761
DegreeMaster of Philosophy
SubjectThree-dimensional integrated circuits.
Electromagnetism - Mathematical models.
Semiconductors - Mathematical models.
Dept/ProgramElectrical and Electronic Engineering
Persistent Identifierhttp://hdl.handle.net/10722/144803
HKU Library Item IDb4704761

 

DC FieldValueLanguage
dc.contributor.advisorWong, N-
dc.contributor.advisorJiang, L-
dc.contributor.authorXu, Yuanzhe.-
dc.contributor.author徐远哲.-
dc.date.issued2011-
dc.identifier.citationXu, Y. [徐远哲]. (2011). Variational analysis for 3D integrated circuit on-chip structures based on process-variation-aware electromagnetic-semiconductor coupled simulation. (Thesis). University of Hong Kong, Pokfulam, Hong Kong SAR. Retrieved from http://dx.doi.org/10.5353/th_b4704761-
dc.identifier.urihttp://hdl.handle.net/10722/144803-
dc.languageeng-
dc.publisherThe University of Hong Kong (Pokfulam, Hong Kong)-
dc.relation.ispartofHKU Theses Online (HKUTO)-
dc.rightsThe author retains all proprietary rights, (such as patent rights) and the right to use in future works.-
dc.rightsThis work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.-
dc.source.urihttp://hub.hku.hk/bib/B47047616-
dc.subject.lcshThree-dimensional integrated circuits.-
dc.subject.lcshElectromagnetism - Mathematical models.-
dc.subject.lcshSemiconductors - Mathematical models.-
dc.titleVariational analysis for 3D integrated circuit on-chip structures based on process-variation-aware electromagnetic-semiconductor coupledsimulation-
dc.typePG_Thesis-
dc.identifier.hkulb4704761-
dc.description.thesisnameMaster of Philosophy-
dc.description.thesislevelMaster-
dc.description.thesisdisciplineElectrical and Electronic Engineering-
dc.description.naturepublished_or_final_version-
dc.identifier.doi10.5353/th_b4704761-
dc.date.hkucongregation2012-
dc.identifier.mmsid991032709329703414-

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