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Book Chapter: Bonding of Clearfil Liner Bond II S to noncarious cervical sclerotic dentin: Interfacial ultrastructure and microtensile bond strength evaluation

TitleBonding of Clearfil Liner Bond II S to noncarious cervical sclerotic dentin: Interfacial ultrastructure and microtensile bond strength evaluation
Authors
Issue Date2000
PublisherOsaka: Kuraray Co. Ltd..
Citation
Bonding of Clearfil Liner Bond II S to noncarious cervical sclerotic dentin: Interfacial ultrastructure and microtensile bond strength evaluation. In Modern Trends in Adhesive Dentistry. Proceedings of the Adhesive Dentistry Forum '99 in Tsurumi, Yokohama, Japan. First Edition, p. 111-132. Osaka: Kuraray Co. Ltd., 2000 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/117828

 

DC FieldValueLanguage
dc.contributor.authorTay, FRCMen_HK
dc.contributor.authorKwong, SMen_HK
dc.contributor.authorItthagarun, Aen_HK
dc.contributor.authorYip, HKen_HK
dc.contributor.authorPashley, DHen_HK
dc.date.accessioned2010-09-26T07:35:51Z-
dc.date.available2010-09-26T07:35:51Z-
dc.date.issued2000en_HK
dc.identifier.citationBonding of Clearfil Liner Bond II S to noncarious cervical sclerotic dentin: Interfacial ultrastructure and microtensile bond strength evaluation. In Modern Trends in Adhesive Dentistry. Proceedings of the Adhesive Dentistry Forum '99 in Tsurumi, Yokohama, Japan. First Edition, p. 111-132. Osaka: Kuraray Co. Ltd., 2000en_HK
dc.identifier.urihttp://hdl.handle.net/10722/117828-
dc.languageengen_HK
dc.publisherOsaka: Kuraray Co. Ltd..en_HK
dc.relation.ispartofModern Trends in Adhesive Dentistry. Proceedings of the Adhesive Dentistry Forum '99 in Tsurumi, Yokohama, Japan. First Editionen_HK
dc.titleBonding of Clearfil Liner Bond II S to noncarious cervical sclerotic dentin: Interfacial ultrastructure and microtensile bond strength evaluationen_HK
dc.typeBook_Chapteren_HK
dc.identifier.emailTay, FRCM: franktay@HKUCC.hku.hken_HK
dc.identifier.emailItthagarun, A: aitthaga@hkusua.hku.hken_HK
dc.identifier.emailYip, HK: kevin.h.k.yip@hkusua.hku.hken_HK
dc.identifier.authorityYip, HK=rp00027en_HK
dc.identifier.hkuros53505en_HK
dc.identifier.spage111en_HK
dc.identifier.epage132en_HK

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