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Conference Paper: Transient crack problem of a functionally graded piezoelectric layer bonded to an elastic layer subjected to electromechanical impact loading

TitleTransient crack problem of a functionally graded piezoelectric layer bonded to an elastic layer subjected to electromechanical impact loading
Authors
Chen, JSoh, AK
Issue Date2003
Citation
Proceedings of the 2003 International Conference on Computational & Experimental Engineering & Sciences, Chapter 11: Damage & Fracture Mechanics, p. paper 99 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/100540

 

DC FieldValueLanguage
dc.contributor.authorChen, Jen_HK
dc.contributor.authorSoh, AKen_HK
dc.date.accessioned2010-09-25T19:13:59Z-
dc.date.available2010-09-25T19:13:59Z-
dc.date.issued2003en_HK
dc.identifier.citationProceedings of the 2003 International Conference on Computational & Experimental Engineering & Sciences, Chapter 11: Damage & Fracture Mechanics, p. paper 99en_HK
dc.identifier.urihttp://hdl.handle.net/10722/100540-
dc.languageengen_HK
dc.relation.ispartofProceedings of the 2003 International Conference on Computational & Experimental Engineering & Sciences, Chapter 11: Damage & Fracture Mechanicsen_HK
dc.titleTransient crack problem of a functionally graded piezoelectric layer bonded to an elastic layer subjected to electromechanical impact loadingen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailSoh, AK: aksoh@HKUCC.hku.hken_HK
dc.identifier.authoritySoh, AK=rp00170en_HK
dc.identifier.hkuros100355en_HK

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