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| Title | Author(s) | Issue Date | |
|---|---|---|---|
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging | 2010 |
| Title | Author(s) | Issue Date | |
|---|---|---|---|
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging | 2010 |