Browsing by Author Tang, Min

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TitleAuthor(s)Issue Date
 
Advisor(s):Li, YLiu, Z
2014
 
2019
 
2018
 
2009
 
2009
 
Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method
Journal:IEEE Transactions on Components, Packaging and Manufacturing Technology
2017