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| Title | Author(s) | Issue Date | |
|---|---|---|---|
Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective Journal:Journal of Physics D: Applied Physics | 2023 |
| Title | Author(s) | Issue Date | |
|---|---|---|---|
Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective Journal:Journal of Physics D: Applied Physics | 2023 |