Showing results 1 to 5 of 5
| Title | Author(s) | Issue Date | |
|---|---|---|---|
Electro-Thermal Device-Package Co-Design for Ultra-Wide Bandgap Gallium Oxide Power Devices Proceeding/Conference:2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022 | 2022 | ||
(Invited) How to Achieve Low Thermal Resistance and High Electrothermal Ruggedness in Ga<inf>2</inf>O<inf>3</inf>Devices? Proceeding/Conference:ECS Transactions | 2021 | ||
Low Thermal Resistance (0.5 K/W) GaO Schottky Rectifiers with Double-Side Packaging Journal:IEEE Electron Device Letters | 2021 | ||
Surge current capability of ultra-wide-bandgap Ga<inf>2</inf>O<inf>3</inf> Schottky diodes Journal:Microelectronics Reliability | 2020 | ||
Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective Journal:Journal of Physics D: Applied Physics | 2023 |