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Browsing by Author Chiang, IT
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Showing results 1 to 10 of 10
Title
Author(s)
Issue Date
A coupled PEC-TDS surface integral equation approach for electromagnetic scattering and radiation from composite metallic and thin dielectric objects
Journal:
IEEE Transactions on Antennas and Propagation
Chiang, IT
Chew, WC
2006
Crosstalk analysis by fast computational algorithms
Proceeding/Conference:
IEEE Topical Meeting on Electrical Performance of Electronic Packaging
Qian, ZG
Xiong, J
Sun, L
Chiang, IT
Chew, WC
Jiang, LJ
Chu, YH
2005
Fast real-time convolution algorithm for microwave multiport networks with nonlinear terminations
Journal:
IEEE Transactions on Circuits and Systems II: Express Briefs
Chiang, IT
Chew, WC
2005
Fast real-time convolution algorithm for transients of nonlinearly-terminated microwave multiport circuits
Journal:
Microwave and Optical Technology Letters
Chiang, IT
Chew, WC
2003
Improvement for scattering by a thin dielectric sheet using surface integral equation
Proceeding/Conference:
IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
Chiang, IT
Chew, WC
2005
Integral equation solvers for real world applications -Some challenge problems
Proceeding/Conference:
IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
Chew, WC
Chiang, IT
Davis, CP
Hesford, A
Li, MK
Liu, Y
Qian, ZG
Saville, M
Sun, L
Tong, MS
Xiong, J
Jiang, LJ
Chao, HY
Chu, YH
2006
Mixing electromagnetic and electrical circuit simulations
Proceeding/Conference:
IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
Chew, WC
Chu, YH
Jiang, LJ
Chiang, IT
Pan, YC
Zhao, JS
2004
New formulation and iterative solution for low-frequency volume integral equation
Journal:
Journal of Electromagnetic Waves and Applications
Chiang, IT
Chew, WC
2005
Thin dielectric sheet simulation by surface integral equation using modified RWG and pulse bases
Journal:
IEEE Transactions on Antennas and Propagation
Chiang, IT
Chew, WC
2006
Toward a more robust and accurate CEM fast integral equation solver for IC applications
Journal:
IEEE Transactions on Advanced Packaging
Chew, WC
Jiang, LJ
Chu, YH
Wang, GL
Chiang, IT
Pan, YC
Zhao, JS
2005