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| Title | Author(s) | Issue Date | |
|---|---|---|---|
Thermal modeling of on-chip interconnects and 3D packaging using EM tools Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP | 2008 |
| Title | Author(s) | Issue Date | |
|---|---|---|---|
Thermal modeling of on-chip interconnects and 3D packaging using EM tools Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP | 2008 |