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Article: Towards a haptic virtual coordinate measuring machine

TitleTowards a haptic virtual coordinate measuring machine
Authors
KeywordsCoordinate measuring machine
Haptic device
Haptic virtual coordinate measuring machine
Inspection planning
Issue Date2004
PublisherElsevier Inc. The Journal's web site is located at http://www.elsevier.com/locate/ijmactool
Citation
International Journal Of Machine Tools And Manufacture, 2004, v. 44 n. 10, p. 1009-1017 How to Cite?
AbstractIn this paper, a novel coordinate measuring machine (CMM) inspection path planning environment, named haptic virtual coordinate measuring machine (HVCMM), is proposed, which makes use of haptic modeling technique for CMM off-line programming. HVCMM is an accurate model of real CMM, simulating a CMM's operation and its measurement process in a virtual environment with haptic perception. It enables CMM off-line programming to take place exactly as if an operator were in front of a real CMM and moving a real CMM probe. To generate the inspection path of a part, teach pendant programming is made by pointing a probe at the 3D computer-aided design (CAD) model of a part using a haptic device. With the HVCMM system, it is much easier to generate collision-free probe path than using other off-line inspection planning methods. Furthermore, when a contact occurs between the CMM and the object, a force is generated based on a proposed mechanics model besides visually showing the contact in the HVCMM environment. Surface voxel is used for quick collision detection. The HVCMM not only facilitates the inspection path planning, but also speeds it up. The proposed HVCMM can also be used for the training of CMM operation. © 2004 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/76057
ISSN
2015 Impact Factor: 3.315
2015 SCImago Journal Rankings: 2.746
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorChen, YHen_HK
dc.contributor.authorWang, YZen_HK
dc.contributor.authorYang, ZYen_HK
dc.date.accessioned2010-09-06T07:17:13Z-
dc.date.available2010-09-06T07:17:13Z-
dc.date.issued2004en_HK
dc.identifier.citationInternational Journal Of Machine Tools And Manufacture, 2004, v. 44 n. 10, p. 1009-1017en_HK
dc.identifier.issn0890-6955en_HK
dc.identifier.urihttp://hdl.handle.net/10722/76057-
dc.description.abstractIn this paper, a novel coordinate measuring machine (CMM) inspection path planning environment, named haptic virtual coordinate measuring machine (HVCMM), is proposed, which makes use of haptic modeling technique for CMM off-line programming. HVCMM is an accurate model of real CMM, simulating a CMM's operation and its measurement process in a virtual environment with haptic perception. It enables CMM off-line programming to take place exactly as if an operator were in front of a real CMM and moving a real CMM probe. To generate the inspection path of a part, teach pendant programming is made by pointing a probe at the 3D computer-aided design (CAD) model of a part using a haptic device. With the HVCMM system, it is much easier to generate collision-free probe path than using other off-line inspection planning methods. Furthermore, when a contact occurs between the CMM and the object, a force is generated based on a proposed mechanics model besides visually showing the contact in the HVCMM environment. Surface voxel is used for quick collision detection. The HVCMM not only facilitates the inspection path planning, but also speeds it up. The proposed HVCMM can also be used for the training of CMM operation. © 2004 Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherElsevier Inc. The Journal's web site is located at http://www.elsevier.com/locate/ijmactoolen_HK
dc.relation.ispartofInternational Journal of Machine Tools and Manufactureen_HK
dc.subjectCoordinate measuring machineen_HK
dc.subjectHaptic deviceen_HK
dc.subjectHaptic virtual coordinate measuring machineen_HK
dc.subjectInspection planningen_HK
dc.titleTowards a haptic virtual coordinate measuring machineen_HK
dc.typeArticleen_HK
dc.identifier.emailChen, YH:yhchen@hkucc.hku.hken_HK
dc.identifier.authorityChen, YH=rp00099en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.ijmachtools.2004.03.005en_HK
dc.identifier.scopuseid_2-s2.0-2442604504en_HK
dc.identifier.hkuros90617en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-2442604504&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume44en_HK
dc.identifier.issue10en_HK
dc.identifier.spage1009en_HK
dc.identifier.epage1017en_HK
dc.identifier.isiWOS:000222224600001-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridChen, YH=7601430448en_HK
dc.identifier.scopusauthoridWang, YZ=35390140600en_HK
dc.identifier.scopusauthoridYang, ZY=7405433286en_HK

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