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Article: A reverse engineering method based on haptic volume removing

TitleA reverse engineering method based on haptic volume removing
Authors
KeywordsConceptual design
Haptic shape modeling
Reverse engineering
Volume sculpting
Issue Date2005
PublisherElsevier Ltd. The Journal's web site is located at http://www.elsevier.com/locate/cad
Citation
Cad Computer Aided Design, 2005, v. 37 n. 1, p. 45-54 How to Cite?
AbstractThis paper presents a new reverse engineering methodology that is based on haptic volume removing. When a physical object is to be digitized, it is first buried in a piece of virtual clay that is generated with the help of a fixture. Now digitizing the physical object is by simply chipping away the virtual clay with a position tracker that is attached to a haptic device PHANToM®. While chipping away the clay, the user can see on the computer monitor what is emerging and at the same time feel the chipping force from the haptic device. By so doing, reverse engineering is seamlessly integrated into haptic volume sculpting that is now widely used for conceptual design. Furthermore, the proposed method has eliminated the need to merge point clouds that are digitized from different views using current digitizers. The virtual clay volume is represented by a spatial run-length encoding scheme. A prototype system has been developed to demonstrate the feasibility of the proposed new method through a case study. The strengths and weaknesses of the presented method are analyzed and the applicability is discussed. © 2004 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/75901
ISSN
2015 Impact Factor: 2.149
2015 SCImago Journal Rankings: 1.078
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorYang, Zen_HK
dc.contributor.authorChen, Yen_HK
dc.date.accessioned2010-09-06T07:15:40Z-
dc.date.available2010-09-06T07:15:40Z-
dc.date.issued2005en_HK
dc.identifier.citationCad Computer Aided Design, 2005, v. 37 n. 1, p. 45-54en_HK
dc.identifier.issn0010-4485en_HK
dc.identifier.urihttp://hdl.handle.net/10722/75901-
dc.description.abstractThis paper presents a new reverse engineering methodology that is based on haptic volume removing. When a physical object is to be digitized, it is first buried in a piece of virtual clay that is generated with the help of a fixture. Now digitizing the physical object is by simply chipping away the virtual clay with a position tracker that is attached to a haptic device PHANToM®. While chipping away the clay, the user can see on the computer monitor what is emerging and at the same time feel the chipping force from the haptic device. By so doing, reverse engineering is seamlessly integrated into haptic volume sculpting that is now widely used for conceptual design. Furthermore, the proposed method has eliminated the need to merge point clouds that are digitized from different views using current digitizers. The virtual clay volume is represented by a spatial run-length encoding scheme. A prototype system has been developed to demonstrate the feasibility of the proposed new method through a case study. The strengths and weaknesses of the presented method are analyzed and the applicability is discussed. © 2004 Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherElsevier Ltd. The Journal's web site is located at http://www.elsevier.com/locate/caden_HK
dc.relation.ispartofCAD Computer Aided Designen_HK
dc.subjectConceptual designen_HK
dc.subjectHaptic shape modelingen_HK
dc.subjectReverse engineeringen_HK
dc.subjectVolume sculptingen_HK
dc.titleA reverse engineering method based on haptic volume removingen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0010-4485&volume=37&spage=45&epage=54&date=2005&atitle=A+reverse+engineering+method+based+on+haptic+volume+removingen_HK
dc.identifier.emailChen, Y:yhchen@hkucc.hku.hken_HK
dc.identifier.authorityChen, Y=rp00099en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.cad.2004.03.003en_HK
dc.identifier.scopuseid_2-s2.0-4544274402en_HK
dc.identifier.hkuros101338en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-4544274402&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume37en_HK
dc.identifier.issue1en_HK
dc.identifier.spage45en_HK
dc.identifier.epage54en_HK
dc.identifier.isiWOS:000225426800004-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridYang, Z=7405433286en_HK
dc.identifier.scopusauthoridChen, Y=7601430448en_HK

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