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Article: On the development of a haptic system for rapid product development

TitleOn the development of a haptic system for rapid product development
Authors
KeywordsHaptic modeling
Rapid product development
Reverse engineering
Virtual prototyping
Issue Date2005
PublisherElsevier Ltd. The Journal's web site is located at http://www.elsevier.com/locate/cad
Citation
Cad Computer Aided Design, 2005, v. 37 n. 5 SPEC.ISS., p. 559-569 How to Cite?
AbstractThis paper presents a system development that extends haptic modeling to a number of key aspects in product development. Since haptic modeling has been developed based on physical laws, it is anticipated that a natural link between the virtual world and practical applications can be established based on haptic interaction. In the proposed system, a haptic device is used as the central mechanism for reverse engineering, shape modeling, real time mechanical property analysis, machining tool path planning and coordinate measuring machine (CMM) tolerance inspection path planning. With all these features in a single haptic system, it is possible to construct a three dimensional part by either haptic shape modeling or reverse engineering, then performing real-time mechanical property analysis in which the stiffness of a part can be felt and intuitively evaluated by the user, or generating collision free cutter tool path and CMM tolerance inspection path. Due to the force feed back in all of the above activities, the product development process is more intuitive, efficient and user-friendly. A prototype system has been developed to demonstrate the proposed capabilities. © 2004 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/75607
ISSN
2015 Impact Factor: 2.149
2015 SCImago Journal Rankings: 1.078
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorChen, Yen_HK
dc.contributor.authorYang, Zen_HK
dc.contributor.authorLian, Len_HK
dc.date.accessioned2010-09-06T07:12:50Z-
dc.date.available2010-09-06T07:12:50Z-
dc.date.issued2005en_HK
dc.identifier.citationCad Computer Aided Design, 2005, v. 37 n. 5 SPEC.ISS., p. 559-569en_HK
dc.identifier.issn0010-4485en_HK
dc.identifier.urihttp://hdl.handle.net/10722/75607-
dc.description.abstractThis paper presents a system development that extends haptic modeling to a number of key aspects in product development. Since haptic modeling has been developed based on physical laws, it is anticipated that a natural link between the virtual world and practical applications can be established based on haptic interaction. In the proposed system, a haptic device is used as the central mechanism for reverse engineering, shape modeling, real time mechanical property analysis, machining tool path planning and coordinate measuring machine (CMM) tolerance inspection path planning. With all these features in a single haptic system, it is possible to construct a three dimensional part by either haptic shape modeling or reverse engineering, then performing real-time mechanical property analysis in which the stiffness of a part can be felt and intuitively evaluated by the user, or generating collision free cutter tool path and CMM tolerance inspection path. Due to the force feed back in all of the above activities, the product development process is more intuitive, efficient and user-friendly. A prototype system has been developed to demonstrate the proposed capabilities. © 2004 Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherElsevier Ltd. The Journal's web site is located at http://www.elsevier.com/locate/caden_HK
dc.relation.ispartofCAD Computer Aided Designen_HK
dc.subjectHaptic modelingen_HK
dc.subjectRapid product developmenten_HK
dc.subjectReverse engineeringen_HK
dc.subjectVirtual prototypingen_HK
dc.titleOn the development of a haptic system for rapid product developmenten_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0010-4485&volume=37&spage=559&epage=569&date=2005&atitle=On+the+development+of+a+haptic+system+for+rapid+product+developmenten_HK
dc.identifier.emailChen, Y:yhchen@hkucc.hku.hken_HK
dc.identifier.authorityChen, Y=rp00099en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.cad.2004.08.004en_HK
dc.identifier.scopuseid_2-s2.0-15744379319en_HK
dc.identifier.hkuros101344en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-15744379319&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume37en_HK
dc.identifier.issue5 SPEC.ISS.en_HK
dc.identifier.spage559en_HK
dc.identifier.epage569en_HK
dc.identifier.isiWOS:000227025400008-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridChen, Y=7601430448en_HK
dc.identifier.scopusauthoridYang, Z=7405433286en_HK
dc.identifier.scopusauthoridLian, L=8943503200en_HK

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