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Conference Paper: Suppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation

TitleSuppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation
Authors
KeywordsEngineering
Electrical engineering
Issue Date2005
PublisherIEEE. The Journal's website is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000568
Citation
The 32nd IEEE International Conference on Plasma Science (ICOPS 2005), Monterey, CA., 18-23 June 2005. In Conference Proceedings, 2005, p. 321 How to Cite?
AbstractSummary form only given. Porous nickel titanium is a promising material for medical application not only because of its super elasticity and shape memory effect but also the porous structure which may enhance bone growth due to the increased surface area. It is thus especially suitable for bone tissue in-growth and fixation of biomedical implants. However, like its dense counterpart, Ni leaching from the materials causes health concern. Thus, in order to suppress Ni diffusion from the materials to body fluids and tissues in humans, a diffusion barrier or similar structure must be introduced. In this work, we produced this diffusion barrier layer by oxygen or nitrogen plasma immersion ion implantation (PIII). In vitro tests were conducted by immersing the plasma-treated NiTi into simulated body fluid (SBF) at 37plusmn0.5degC for 5 weeks and the resulting SBF was analyzed for Ni and Ti using inductively-coupled plasma mass spectrometry (ICMPS). Our results show that Ni leaching is significantly mitigated by both nitrogen and oxygen PIII.
Persistent Identifierhttp://hdl.handle.net/10722/54170
ISSN

 

DC FieldValueLanguage
dc.contributor.authorHo, JPYen_HK
dc.contributor.authorWu, SLen_HK
dc.contributor.authorPoon, RWYen_HK
dc.contributor.authorLiu, XYen_HK
dc.contributor.authorChung, CYen_HK
dc.contributor.authorChu, PKen_HK
dc.contributor.authorYeung, KWKen_HK
dc.contributor.authorLu, WWen_HK
dc.contributor.authorCheung, KMCen_HK
dc.date.accessioned2009-04-03T07:38:35Z-
dc.date.available2009-04-03T07:38:35Z-
dc.date.issued2005en_HK
dc.identifier.citationThe 32nd IEEE International Conference on Plasma Science (ICOPS 2005), Monterey, CA., 18-23 June 2005. In Conference Proceedings, 2005, p. 321en_HK
dc.identifier.issn0730-9244en_HK
dc.identifier.urihttp://hdl.handle.net/10722/54170-
dc.description.abstractSummary form only given. Porous nickel titanium is a promising material for medical application not only because of its super elasticity and shape memory effect but also the porous structure which may enhance bone growth due to the increased surface area. It is thus especially suitable for bone tissue in-growth and fixation of biomedical implants. However, like its dense counterpart, Ni leaching from the materials causes health concern. Thus, in order to suppress Ni diffusion from the materials to body fluids and tissues in humans, a diffusion barrier or similar structure must be introduced. In this work, we produced this diffusion barrier layer by oxygen or nitrogen plasma immersion ion implantation (PIII). In vitro tests were conducted by immersing the plasma-treated NiTi into simulated body fluid (SBF) at 37plusmn0.5degC for 5 weeks and the resulting SBF was analyzed for Ni and Ti using inductively-coupled plasma mass spectrometry (ICMPS). Our results show that Ni leaching is significantly mitigated by both nitrogen and oxygen PIII.-
dc.languageengen_HK
dc.publisherIEEE. The Journal's website is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000568en_HK
dc.relation.ispartofIEEE Conference Record - Abstracts-
dc.rightsThis work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.-
dc.rights©2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_HK
dc.rightsIEEE Conference Record - Abstracts. Copyright © IEEE.-
dc.subjectEngineeringen_HK
dc.subjectElectrical engineeringen_HK
dc.titleSuppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantationen_HK
dc.typeConference_Paperen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0730-9244&volume=&spage=321&epage=&date=2005&atitle=Suppression+of+nickel+out-diffusion+from+porous+nickel-titanium+shape+memory+alloy+by+plasma+immersion+ion+implantationen_HK
dc.identifier.emailYeung, KWK: wkkyeung@graduate.hku.hken_HK
dc.identifier.emailLu, WW: wwlu@hkusua.hku.hken_HK
dc.identifier.emailCheung, KMC: cheungmc@hku.hken_HK
dc.description.naturepublished_or_final_versionen_HK
dc.identifier.doi10.1109/PLASMA.2005.359457-
dc.identifier.hkuros105954-
dc.customcontrol.immutablesml 170331 amended-

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