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Conference Paper: Suppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation
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TitleSuppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation
 
AuthorsHo, JPY
Wu, SL
Poon, RWY
Liu, XY
Chung, CY
Chu, PK
Yeung, KWK
Lu, WW
Cheung, KMC
 
KeywordsEngineering
Electrical engineering
 
Issue Date2005
 
PublisherIEEE.
 
CitationThe 32nd IEEE International Conference on Plasma Science, Monterey, California, USA, 18-23 June 2005, p. 321 [How to Cite?]
 
ISSN0730-9244
 
DC FieldValue
dc.contributor.authorHo, JPY
 
dc.contributor.authorWu, SL
 
dc.contributor.authorPoon, RWY
 
dc.contributor.authorLiu, XY
 
dc.contributor.authorChung, CY
 
dc.contributor.authorChu, PK
 
dc.contributor.authorYeung, KWK
 
dc.contributor.authorLu, WW
 
dc.contributor.authorCheung, KMC
 
dc.date.accessioned2009-04-03T07:38:35Z
 
dc.date.available2009-04-03T07:38:35Z
 
dc.date.issued2005
 
dc.description.naturepublished_or_final_version
 
dc.identifier.citationThe 32nd IEEE International Conference on Plasma Science, Monterey, California, USA, 18-23 June 2005, p. 321 [How to Cite?]
 
dc.identifier.hkuros105954
 
dc.identifier.issn0730-9244
 
dc.identifier.openurl
 
dc.identifier.urihttp://hdl.handle.net/10722/54170
 
dc.languageeng
 
dc.publisherIEEE.
 
dc.rights©2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
 
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License
 
dc.subjectEngineering
 
dc.subjectElectrical engineering
 
dc.titleSuppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation
 
dc.typeConference_Paper
 
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