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Conference Paper: Suppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation
Title | Suppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation |
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Authors | |
Keywords | Engineering Electrical engineering |
Issue Date | 2005 |
Publisher | IEEE. The Journal's website is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000568 |
Citation | The 32nd IEEE International Conference on Plasma Science (ICOPS 2005), Monterey, CA., 18-23 June 2005. In Conference Proceedings, 2005, p. 321 How to Cite? |
Abstract | Summary form only given. Porous nickel titanium is a promising material for medical application not only because of its super elasticity and shape memory effect but also the porous structure which may enhance bone growth due to the increased surface area. It is thus especially suitable for bone tissue in-growth and fixation of biomedical implants. However, like its dense counterpart, Ni leaching from the materials causes health concern. Thus, in order to suppress Ni diffusion from the materials to body fluids and tissues in humans, a diffusion barrier or similar structure must be introduced. In this work, we produced this diffusion barrier layer by oxygen or nitrogen plasma immersion ion implantation (PIII). In vitro tests were conducted by immersing the plasma-treated NiTi into simulated body fluid (SBF) at 37plusmn0.5degC for 5 weeks and the resulting SBF was analyzed for Ni and Ti using inductively-coupled plasma mass spectrometry (ICMPS). Our results show that Ni leaching is significantly mitigated by both nitrogen and oxygen PIII. |
Persistent Identifier | http://hdl.handle.net/10722/54170 |
ISSN | 2023 SCImago Journal Rankings: 0.110 |
DC Field | Value | Language |
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dc.contributor.author | Ho, JPY | en_HK |
dc.contributor.author | Wu, SL | en_HK |
dc.contributor.author | Poon, RWY | en_HK |
dc.contributor.author | Liu, XY | en_HK |
dc.contributor.author | Chung, CY | en_HK |
dc.contributor.author | Chu, PK | en_HK |
dc.contributor.author | Yeung, KWK | en_HK |
dc.contributor.author | Lu, WW | en_HK |
dc.contributor.author | Cheung, KMC | en_HK |
dc.date.accessioned | 2009-04-03T07:38:35Z | - |
dc.date.available | 2009-04-03T07:38:35Z | - |
dc.date.issued | 2005 | en_HK |
dc.identifier.citation | The 32nd IEEE International Conference on Plasma Science (ICOPS 2005), Monterey, CA., 18-23 June 2005. In Conference Proceedings, 2005, p. 321 | en_HK |
dc.identifier.issn | 0730-9244 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/54170 | - |
dc.description.abstract | Summary form only given. Porous nickel titanium is a promising material for medical application not only because of its super elasticity and shape memory effect but also the porous structure which may enhance bone growth due to the increased surface area. It is thus especially suitable for bone tissue in-growth and fixation of biomedical implants. However, like its dense counterpart, Ni leaching from the materials causes health concern. Thus, in order to suppress Ni diffusion from the materials to body fluids and tissues in humans, a diffusion barrier or similar structure must be introduced. In this work, we produced this diffusion barrier layer by oxygen or nitrogen plasma immersion ion implantation (PIII). In vitro tests were conducted by immersing the plasma-treated NiTi into simulated body fluid (SBF) at 37plusmn0.5degC for 5 weeks and the resulting SBF was analyzed for Ni and Ti using inductively-coupled plasma mass spectrometry (ICMPS). Our results show that Ni leaching is significantly mitigated by both nitrogen and oxygen PIII. | - |
dc.language | eng | en_HK |
dc.publisher | IEEE. The Journal's website is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000568 | en_HK |
dc.relation.ispartof | IEEE Conference Record - Abstracts | - |
dc.rights | ©2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. | - |
dc.subject | Engineering | en_HK |
dc.subject | Electrical engineering | en_HK |
dc.title | Suppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation | en_HK |
dc.type | Conference_Paper | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0730-9244&volume=&spage=321&epage=&date=2005&atitle=Suppression+of+nickel+out-diffusion+from+porous+nickel-titanium+shape+memory+alloy+by+plasma+immersion+ion+implantation | en_HK |
dc.identifier.email | Yeung, KWK: wkkyeung@graduate.hku.hk | en_HK |
dc.identifier.email | Lu, WW: wwlu@hkusua.hku.hk | en_HK |
dc.identifier.email | Cheung, KMC: cheungmc@hku.hk | en_HK |
dc.description.nature | published_or_final_version | en_HK |
dc.identifier.doi | 10.1109/PLASMA.2005.359457 | - |
dc.identifier.hkuros | 105954 | - |
dc.customcontrol.immutable | sml 170331 amended | - |
dc.identifier.issnl | 0730-9244 | - |