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Conference Paper: Suppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation

TitleSuppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation
Authors
KeywordsEngineering
Electrical engineering
Issue Date2005
PublisherIEEE.
Citation
The 32nd IEEE International Conference on Plasma Science, Monterey, California, USA, 18-23 June 2005, p. 321 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/54170
ISSN

 

DC FieldValueLanguage
dc.contributor.authorHo, JPYen_HK
dc.contributor.authorWu, SLen_HK
dc.contributor.authorPoon, RWYen_HK
dc.contributor.authorLiu, XYen_HK
dc.contributor.authorChung, CYen_HK
dc.contributor.authorChu, PKen_HK
dc.contributor.authorYeung, KWKen_HK
dc.contributor.authorLu, WWen_HK
dc.contributor.authorCheung, KMCen_HK
dc.date.accessioned2009-04-03T07:38:35Z-
dc.date.available2009-04-03T07:38:35Z-
dc.date.issued2005en_HK
dc.identifier.citationThe 32nd IEEE International Conference on Plasma Science, Monterey, California, USA, 18-23 June 2005, p. 321en_HK
dc.identifier.issn0730-9244en_HK
dc.identifier.urihttp://hdl.handle.net/10722/54170-
dc.languageengen_HK
dc.publisherIEEE.en_HK
dc.rights©2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.subjectEngineeringen_HK
dc.subjectElectrical engineeringen_HK
dc.titleSuppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantationen_HK
dc.typeConference_Paperen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0730-9244&volume=&spage=321&epage=&date=2005&atitle=Suppression+of+nickel+out-diffusion+from+porous+nickel-titanium+shape+memory+alloy+by+plasma+immersion+ion+implantationen_HK
dc.identifier.emailYeung, KWK: wkkyeung@graduate.hku.hken_HK
dc.identifier.emailLu, WW: wwlu@hkusua.hku.hken_HK
dc.identifier.emailCheung, KMC: cheungmc@hku.hken_HK
dc.description.naturepublished_or_final_versionen_HK
dc.identifier.hkuros105954-

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