Conference Paper: Suppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation

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TitleSuppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation
AuthorsHo, JPY
Wu, SL
Poon, RWY
Liu, XY
Chung, CY
Chu, PK
Yeung, KWK
Lu, WW
Cheung, KMC
KeywordsEngineering
Electrical engineering
Issue Date2005
PublisherIEEE.
CitationThe 32nd IEEE International Conference on Plasma Science, Monterey, California, USA, 18-23 June 2005, p. 321 [How to Cite?]
ISSN0730-9244
2011 SCImago Journal Rankings: 0.025
DC Field
Value
dc.contributor.authorHo, JPY
dc.contributor.authorWu, SL
dc.contributor.authorPoon, RWY
dc.contributor.authorLiu, XY
dc.contributor.authorChung, CY
dc.contributor.authorChu, PK
dc.contributor.authorYeung, KWK
dc.contributor.authorLu, WW
dc.contributor.authorCheung, KMC
dc.date.accessioned2009-04-03T07:38:35Z
dc.date.available2009-04-03T07:38:35Z
dc.date.issued2005
dc.description.naturepublished_or_final_version
dc.identifier.citationThe 32nd IEEE International Conference on Plasma Science, Monterey, California, USA, 18-23 June 2005, p. 321 [How to Cite?]
dc.identifier.hkuros105954
dc.identifier.issn0730-9244
2011 SCImago Journal Rankings: 0.025
dc.identifier.openurl
dc.identifier.urihttp://hdl.handle.net/10722/54170
dc.languageeng
dc.publisherIEEE.
dc.rights©2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License
dc.subjectEngineering
dc.subjectElectrical engineering
dc.titleSuppression of nickel out-diffusion from porous nickel-titanium shape memory alloy by plasma immersion ion implantation
dc.typeConference_Paper