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Conference Paper: Analysis of the mould void problems by statistical process control on a 28x28mm Quad-Flat-Package integrating circuit
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TitleAnalysis of the mould void problems by statistical process control on a 28x28mm Quad-Flat-Package integrating circuit
 
AuthorsLau, RMH
Wong, ACY
 
Issue Date1994
 
PublisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000405
 
CitationThe 3rd International Symposium on Consumer Electronics, Hong Kong Convention & Exhibition Centre, Hong Kong, 14-16 November 1994, p. 400-404 [How to Cite?]
 
DC FieldValue
dc.contributor.authorLau, RMH
 
dc.contributor.authorWong, ACY
 
dc.date.accessioned2009-04-03T07:36:25Z
 
dc.date.available2009-04-03T07:36:25Z
 
dc.date.issued1994
 
dc.description.naturepublished_or_final_version
 
dc.identifier.citationThe 3rd International Symposium on Consumer Electronics, Hong Kong Convention & Exhibition Centre, Hong Kong, 14-16 November 1994, p. 400-404 [How to Cite?]
 
dc.identifier.hkuros1833
 
dc.identifier.urihttp://hdl.handle.net/10722/54088
 
dc.languageeng
 
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000405
 
dc.rights©1994 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
 
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License
 
dc.titleAnalysis of the mould void problems by statistical process control on a 28x28mm Quad-Flat-Package integrating circuit
 
dc.typeConference_Paper
 
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<rights>Creative Commons: Attribution 3.0 Hong Kong License</rights>
<title>Analysis of the mould void problems by statistical process control on a 28x28mm Quad-Flat-Package integrating circuit</title>
<type>Conference_Paper</type>
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