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Conference Paper: Analysis of the mould void problems by statistical process control on a 28x28mm Quad-Flat-Package integrating circuit

TitleAnalysis of the mould void problems by statistical process control on a 28x28mm Quad-Flat-Package integrating circuit
Authors
Lau, RMHWong, ACY
Issue Date1994
PublisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000405
Citation
The 3rd International Symposium on Consumer Electronics, Hong Kong Convention & Exhibition Centre, Hong Kong, 14-16 November 1994, p. 400-404 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/54088

 

DC FieldValueLanguage
dc.contributor.authorLau, RMHen_HK
dc.contributor.authorWong, ACYen_HK
dc.date.accessioned2009-04-03T07:36:25Z-
dc.date.available2009-04-03T07:36:25Z-
dc.date.issued1994en_HK
dc.identifier.citationThe 3rd International Symposium on Consumer Electronics, Hong Kong Convention & Exhibition Centre, Hong Kong, 14-16 November 1994, p. 400-404en_HK
dc.identifier.urihttp://hdl.handle.net/10722/54088-
dc.languageengen_HK
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000405en_HK
dc.rights©1994 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_HK
dc.titleAnalysis of the mould void problems by statistical process control on a 28x28mm Quad-Flat-Package integrating circuiten_HK
dc.typeConference_Paperen_HK
dc.identifier.emailWong, ACY: hreiwcy@hkucc.hku.hken_HK
dc.description.naturepublished_or_final_versionen_HK
dc.identifier.hkuros1833-

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