| Title | Analysis of the mould void problems by statistical process control on a 28x28mm Quad-Flat-Package integrating circuit |
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| Authors | Lau, RMH
Wong, ACY |
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| Issue Date | 1994 |
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| Publisher | IEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000405 |
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| Citation | The 3rd International Symposium on Consumer Electronics, Hong Kong Convention & Exhibition Centre, Hong Kong, 14-16 November 1994, p. 400-404 |
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| DC Field | Value |
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| dc.contributor.author | Lau, RMH |
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| dc.contributor.author | Wong, ACY |
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| dc.date.accessioned | 2009-04-03T07:36:25Z |
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| dc.date.available | 2009-04-03T07:36:25Z |
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| dc.date.issued | 1994 |
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| dc.description.nature | published_or_final_version |
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| dc.identifier.citation | The 3rd International Symposium on Consumer Electronics, Hong Kong Convention & Exhibition Centre, Hong Kong, 14-16 November 1994, p. 400-404 |
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| dc.identifier.hkuros | 1833 |
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| dc.identifier.uri | http://hdl.handle.net/10722/54088 |
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| dc.language | eng |
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| dc.publisher | IEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000405 |
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| dc.rights | ©1994 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. |
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| dc.rights | Creative Commons: Attribution 3.0 Hong Kong License |
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| dc.title | Analysis of the mould void problems by statistical process control on a 28x28mm Quad-Flat-Package integrating circuit |
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| dc.type | Conference_Paper |
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