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Conference Paper: A CAD/CAM package for free-surfaced mould cavities

TitleA CAD/CAM package for free-surfaced mould cavities
Authors
Choi, SH
Issue Date1994
PublisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000405
Citation
The 3rd International Symposium on Consumer Electronics, Hong Kong, China, 14-16 November 1994. In Conference Proceedings, 1994, p. 517-522 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/54086

 

DC FieldValueLanguage
dc.contributor.authorChoi, SHen_HK
dc.date.accessioned2009-04-03T07:36:22Z-
dc.date.available2009-04-03T07:36:22Z-
dc.date.issued1994en_HK
dc.identifier.citationThe 3rd International Symposium on Consumer Electronics, Hong Kong, China, 14-16 November 1994. In Conference Proceedings, 1994, p. 517-522en_HK
dc.identifier.urihttp://hdl.handle.net/10722/54086-
dc.languageengen_HK
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000405en_HK
dc.relation.ispartofInternational Symposium on Consumer Electronics-
dc.rights©1994 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_HK
dc.titleA CAD/CAM package for free-surfaced mould cavitiesen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailChoi, SH: shchoi@hkucc.hku.hken_HK
dc.description.naturepublished_or_final_versionen_HK
dc.identifier.hkuros12685-
dc.identifier.spage517-
dc.identifier.epage522-

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