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Conference Paper: High sensitivity 2-D force sensor for assembly of surface MEMS devices

TitleHigh sensitivity 2-D force sensor for assembly of surface MEMS devices
Authors
Issue Date2004
Citation
2004 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), 2004, v. 4, p. 3363-3368 How to Cite?
AbstractThis paper aims at advancing micromanipulation technology with in situ polyvinylidene fluoride (PVDF) piezoelectric force sensing during microassembly and packaging process. Based on the previously developed PVDF 1-D sensor, by employing the parallel beam structure, a novel 2-D force sensor with relatively high natural frequency and sensitivity is optimally designed. The sensor can detect micro force and force rate signals which can be fed back so as to greatly improve the reliability of microassembly. Preliminary calibration and experimental results on assembly of surface MEMS devices both verified the performance of the new 2-D sensor that demonstrates a high sensitivity and a resolution in the range of μN. Ultimately the technology will provide a critical and major step towards the development of automated micro-manufacturing processes for batch assembly of micro devices.
Persistent Identifierhttp://hdl.handle.net/10722/212799

 

DC FieldValueLanguage
dc.contributor.authorShen, Yantao-
dc.contributor.authorXi, Ning-
dc.contributor.authorWejinya, U. C.-
dc.contributor.authorLi, Wen J.-
dc.date.accessioned2015-07-28T04:05:03Z-
dc.date.available2015-07-28T04:05:03Z-
dc.date.issued2004-
dc.identifier.citation2004 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), 2004, v. 4, p. 3363-3368-
dc.identifier.urihttp://hdl.handle.net/10722/212799-
dc.description.abstractThis paper aims at advancing micromanipulation technology with in situ polyvinylidene fluoride (PVDF) piezoelectric force sensing during microassembly and packaging process. Based on the previously developed PVDF 1-D sensor, by employing the parallel beam structure, a novel 2-D force sensor with relatively high natural frequency and sensitivity is optimally designed. The sensor can detect micro force and force rate signals which can be fed back so as to greatly improve the reliability of microassembly. Preliminary calibration and experimental results on assembly of surface MEMS devices both verified the performance of the new 2-D sensor that demonstrates a high sensitivity and a resolution in the range of μN. Ultimately the technology will provide a critical and major step towards the development of automated micro-manufacturing processes for batch assembly of micro devices.-
dc.languageeng-
dc.relation.ispartof2004 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS)-
dc.titleHigh sensitivity 2-D force sensor for assembly of surface MEMS devices-
dc.typeConference_Paper-
dc.description.natureLink_to_subscribed_fulltext-
dc.identifier.scopuseid_2-s2.0-14044268282-
dc.identifier.volume4-
dc.identifier.spage3363-
dc.identifier.epage3368-

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