granted patent: Bioactive And Osteoprorotic Bone Cement

TitleBioactive And Osteoprorotic Bone Cement
Granted PatentCN 1414868
Granted Date2003-04-30
Priority Date2000-01-03 US 09/174204P
2000-11-09 US 09/710536
Inventors
Issue Date2003
Citation
China Patent 1414868. Beijing, PRC: State Intellectual Property Office (SIPO) of the P.R.C., 2003 How to Cite?
AbstractA Composition For Use As A Bioactive Bone Cement Having A Powder Component Including Strontium-Containing Hydroxy Apatite And Formulated To Create A Settable Fluid Substance When Mixed With A Liquid Component. The Liquid Component Includes A Bisphenol A Diglycidylether Dimethacrylate Resin Which When Mixed With The Powder Component Creates A Bioactive Bone Cement. The Bioactive Bone Cement Can Alternatively Be In The Form Of A Two Paste Component System In Which A First Paste Component Including Strontium-Containing Hydroxy Apatite, Bisphenol A Diglycidylether Dimethacrylate Resin And A Polymerization Initiator Is Formulated To Create A Settable Paste Substance When Mixed With A Second Paste Component.; The Second Paste Component Includes Strontium-Containing Hydroxy Apatite, Bisphenol A Diglycidylether Dimethacrylate Resin, And A Polymerization Accelerator Which When Mixed Together With The First Paste Component Creates A Bioactive Bone Cement.
Persistent Identifierhttp://hdl.handle.net/10722/173815

 

DC FieldValueLanguage
dc.date.accessioned2012-11-02T06:19:26Z-
dc.date.available2012-11-02T06:19:26Z-
dc.date.issued2003-
dc.identifier.citationChina Patent 1414868. Beijing, PRC: State Intellectual Property Office (SIPO) of the P.R.C., 2003en_HK
dc.identifier.urihttp://hdl.handle.net/10722/173815-
dc.description.abstractA Composition For Use As A Bioactive Bone Cement Having A Powder Component Including Strontium-Containing Hydroxy Apatite And Formulated To Create A Settable Fluid Substance When Mixed With A Liquid Component. The Liquid Component Includes A Bisphenol A Diglycidylether Dimethacrylate Resin Which When Mixed With The Powder Component Creates A Bioactive Bone Cement. The Bioactive Bone Cement Can Alternatively Be In The Form Of A Two Paste Component System In Which A First Paste Component Including Strontium-Containing Hydroxy Apatite, Bisphenol A Diglycidylether Dimethacrylate Resin And A Polymerization Initiator Is Formulated To Create A Settable Paste Substance When Mixed With A Second Paste Component.; The Second Paste Component Includes Strontium-Containing Hydroxy Apatite, Bisphenol A Diglycidylether Dimethacrylate Resin, And A Polymerization Accelerator Which When Mixed Together With The First Paste Component Creates A Bioactive Bone Cement.en_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License For Public Patent Documentsen_US
dc.titleBioactive And Osteoprorotic Bone Cementen_HK
dc.typePatenten_US
dc.identifier.emailCheung, KMC=ken-cheung@hku.hk-
dc.identifier.emailLu, WW=wwlu@hkusua.hku.hk-
dc.identifier.emailLuk, KDK=hrmoldk@hkucc.hku.hk-
dc.identifier.authorityCheung, KMC:rp00387-
dc.identifier.authorityLu, WW:rp00411-
dc.identifier.authorityLuk, KDK:rp00333-
dc.description.naturepublished_or_final_versionen_US
dc.contributor.inventorCheung, KMC-
dc.contributor.inventorLeong, John Chi Yan-
dc.contributor.inventorLi, Yi Wen-
dc.contributor.inventorLu, WW-
dc.contributor.inventorLuk, KDK-
patents.identifier.applicationCN 20008018053en_HK
patents.identifier.grantedCN 1414868en_HK
patents.description.assigneeGangda Hengde Bone Biocology S [Hk]en_HK
patents.description.countryChina, PRCen_HK
patents.date.granted2003-04-30en_HK
patents.identifier.hkutechidO&T-2000-00016en_HK
patents.date.application2000-12-08en_HK
patents.date.priority2000-01-03 US 09/174204Pen_HK
patents.date.priority2000-11-09 US 09/710536en_HK
patents.description.ccCNen_HK
patents.relation.familyCA 2395910 (A1) 2001-07-12en_HK
patents.relation.familyCN 1414868 (A) 2003-04-30en_HK
patents.relation.familyCN 1229146 (C) 2005-11-30en_HK
patents.relation.familyEP 1246651 (A2) 2002-10-09en_HK
patents.relation.familyHK 1046378 (A1) 2009-07-17en_HK
patents.relation.familyJP 2003518989 (A) 2003-06-17en_HK
patents.relation.familyUS 6593394 (B1) 2003-07-15en_HK
patents.relation.familyWO 0149327 (A2) 2001-07-12en_HK
patents.description.kindAen_HK
patents.typePatent_granteden_HK

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