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Conference Paper: Accessibility analysis for CMM inspection planning by means of haptic device and STL representation
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TitleAccessibility analysis for CMM inspection planning by means of haptic device and STL representation
 
AuthorsWang, Y1
Chen, Y3
Zhang, W2
Liu, D1
Zhang, R1
 
KeywordsAccessibility Analysis
Cmm
Haptic Device
Stl
 
Issue Date2009
 
Citation2009 Ieee International Conference On Virtual Environments, Human-Computer Interfaces, And Measurements Systems, Vecims 2009 - Proceedings, 2009, p. 174-178 [How to Cite?]
DOI: http://dx.doi.org/10.1109/VECIMS.2009.5068888
 
AbstractInspection planning plays one of important roles in examining a manufactured part in 3D sizes, positions and forms using coordinate measuring machine (CMM). Accessibility Analysis must be done during CMM inspection planning. Usually, accessibility analysis is based on the computation of a part's computer-aided design (CAD) model and the model of a probe. In this paper, a new accessibility analysis method for CMM inspection planning is proposed based on a haptic device and STL representation. Different collision modes are analyzed. A quick collision detection algorithm is given, which is based on the STL representation. Force response is analyzed to distinguish between an occurred collision and a normal contacting of the tip to an inspection point. Using STL representation, the virtual CMM probe unit model is more precise, which results in the accessibility analysis implemented precisely. With the force feedback generated by a Phantom Desktop haptic device, the accessibility analysis is performed much easier. ©2009 IEEE.
 
DOIhttp://dx.doi.org/10.1109/VECIMS.2009.5068888
 
ISI Accession Number IDWOS:000270760700034
 
ReferencesReferences in Scopus
 
DC FieldValue
dc.contributor.authorWang, Y
 
dc.contributor.authorChen, Y
 
dc.contributor.authorZhang, W
 
dc.contributor.authorLiu, D
 
dc.contributor.authorZhang, R
 
dc.date.accessioned2012-08-08T09:05:04Z
 
dc.date.available2012-08-08T09:05:04Z
 
dc.date.issued2009
 
dc.description.abstractInspection planning plays one of important roles in examining a manufactured part in 3D sizes, positions and forms using coordinate measuring machine (CMM). Accessibility Analysis must be done during CMM inspection planning. Usually, accessibility analysis is based on the computation of a part's computer-aided design (CAD) model and the model of a probe. In this paper, a new accessibility analysis method for CMM inspection planning is proposed based on a haptic device and STL representation. Different collision modes are analyzed. A quick collision detection algorithm is given, which is based on the STL representation. Force response is analyzed to distinguish between an occurred collision and a normal contacting of the tip to an inspection point. Using STL representation, the virtual CMM probe unit model is more precise, which results in the accessibility analysis implemented precisely. With the force feedback generated by a Phantom Desktop haptic device, the accessibility analysis is performed much easier. ©2009 IEEE.
 
dc.description.naturelink_to_subscribed_fulltext
 
dc.identifier.citation2009 Ieee International Conference On Virtual Environments, Human-Computer Interfaces, And Measurements Systems, Vecims 2009 - Proceedings, 2009, p. 174-178 [How to Cite?]
DOI: http://dx.doi.org/10.1109/VECIMS.2009.5068888
 
dc.identifier.doihttp://dx.doi.org/10.1109/VECIMS.2009.5068888
 
dc.identifier.epage178
 
dc.identifier.isiWOS:000270760700034
 
dc.identifier.scopuseid_2-s2.0-70349926021
 
dc.identifier.spage174
 
dc.identifier.urihttp://hdl.handle.net/10722/159003
 
dc.languageeng
 
dc.relation.ispartof2009 IEEE International Conference on Virtual Environments, Human-Computer Interfaces, and Measurements Systems, VECIMS 2009 - Proceedings
 
dc.relation.referencesReferences in Scopus
 
dc.subjectAccessibility Analysis
 
dc.subjectCmm
 
dc.subjectHaptic Device
 
dc.subjectStl
 
dc.titleAccessibility analysis for CMM inspection planning by means of haptic device and STL representation
 
dc.typeConference_Paper
 
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Author Affiliations
  1. Tianjin University of Science &amp; Technology
  2. CASIC System Simulation Technology (Beijing) Co., Ltd.
  3. The University of Hong Kong