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Conference Paper: Accessibility analysis for CMM inspection planning using haptic device
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TitleAccessibility analysis for CMM inspection planning using haptic device
 
AuthorsWang, Y1
Nan, Z1
Chen, Y2
Hu, Y2
 
KeywordsAccessibility analysis
Haptic device
HVCMM
Inspection planning
 
Issue Date2006
 
Citation2006 Ieee International Conference On Robotics And Biomimetics, Robio 2006, 2006, p. 1239-1243 [How to Cite?]
DOI: http://dx.doi.org/10.1109/ROBIO.2006.340105
 
AbstractCoordinate measuring machines (CMMs) are widely used in manufacturing industry to examine the conformity of produced parts with designers' intent in 3D sizes, positions and forms. Accessibility analysis plays an important roIe in CMM inspection planning. Traditional methods of accessibility analysis are based on the computation of a part's computer-aided design (CAD) model and the model of a probe. In this paper, a novel accessibility analysis method for CMM inspection planning is proposed based on a haptic virtual CMM (HVCMM). The HVCMM is an accurate model of real CMM, which simulating CMMs' operation and their measurement process in a virtual environment with haptic perception. The collision modes while performing accessibility analysis are given. To achieve quick collision detection, spatial run-length encoding is used to represent both the part and the probe. Collision response is analyzed for distinguishing whether a collision is occurred. With the force feedback when the probe collides with a part, plus showing the contact in the HVCMM environment, it is much easier to perform the accessibility analysis. The haptic response is implemented with a Phantom haptic arm from SensAble© Technologies ©2006 IEEE.
 
DOIhttp://dx.doi.org/10.1109/ROBIO.2006.340105
 
ReferencesReferences in Scopus
 
DC FieldValue
dc.contributor.authorWang, Y
 
dc.contributor.authorNan, Z
 
dc.contributor.authorChen, Y
 
dc.contributor.authorHu, Y
 
dc.date.accessioned2012-08-08T09:04:58Z
 
dc.date.available2012-08-08T09:04:58Z
 
dc.date.issued2006
 
dc.description.abstractCoordinate measuring machines (CMMs) are widely used in manufacturing industry to examine the conformity of produced parts with designers' intent in 3D sizes, positions and forms. Accessibility analysis plays an important roIe in CMM inspection planning. Traditional methods of accessibility analysis are based on the computation of a part's computer-aided design (CAD) model and the model of a probe. In this paper, a novel accessibility analysis method for CMM inspection planning is proposed based on a haptic virtual CMM (HVCMM). The HVCMM is an accurate model of real CMM, which simulating CMMs' operation and their measurement process in a virtual environment with haptic perception. The collision modes while performing accessibility analysis are given. To achieve quick collision detection, spatial run-length encoding is used to represent both the part and the probe. Collision response is analyzed for distinguishing whether a collision is occurred. With the force feedback when the probe collides with a part, plus showing the contact in the HVCMM environment, it is much easier to perform the accessibility analysis. The haptic response is implemented with a Phantom haptic arm from SensAble© Technologies ©2006 IEEE.
 
dc.description.natureLink_to_subscribed_fulltext
 
dc.identifier.citation2006 Ieee International Conference On Robotics And Biomimetics, Robio 2006, 2006, p. 1239-1243 [How to Cite?]
DOI: http://dx.doi.org/10.1109/ROBIO.2006.340105
 
dc.identifier.doihttp://dx.doi.org/10.1109/ROBIO.2006.340105
 
dc.identifier.epage1243
 
dc.identifier.scopuseid_2-s2.0-46249109561
 
dc.identifier.spage1239
 
dc.identifier.urihttp://hdl.handle.net/10722/158986
 
dc.languageeng
 
dc.relation.ispartof2006 IEEE International Conference on Robotics and Biomimetics, ROBIO 2006
 
dc.relation.referencesReferences in Scopus
 
dc.subjectAccessibility analysis
 
dc.subjectHaptic device
 
dc.subjectHVCMM
 
dc.subjectInspection planning
 
dc.titleAccessibility analysis for CMM inspection planning using haptic device
 
dc.typeConference_Paper
 
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Author Affiliations
  1. Tianjin University of Science &amp; Technology
  2. The University of Hong Kong