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Article: Haptic modeling in rapid product development

TitleHaptic modeling in rapid product development
Authors
KeywordsHaptic Modeling
Product Development
Reverse Engineering
Tool Path Planning
Issue Date2004
PublisherC A D Solutions. The Journal's web site is located at http://www.cadanda.com
Citation
Computer-Aided Design And Applications, 2004, v. 1 n. 1-4, p. 577-584 How to Cite?
Abstract
This paper presents an integrated product development platform. Haptic modeling, due to its growing applications to different aspects of product development, is envisioned as the core technology for the proposed rapid product development platform. Since haptic modeling is developed based on physical laws, it is anticipated as the natural link between the virtual world and practical applications. In the proposed platform, haptic devices are used as the central mechanisms for reverse engineering, shape modeling, virtual prototyping, machining tool path planning and tolerance inspection path planning. The hardware system is constructed by attaching a digitizing probe to a haptic device Phantom®. This configuration enables the force guided digitization in reverse engineering. When a three dimensional computer model is constructed by either haptic shape modeling or reverse engineering, both tool path planning and coordinate measuring machine (CMM) tolerance inspection path planning can be carried out in a haptic environment. Physical models can be made by either computer numerical controlled machining or rapid prototyping machines.
Persistent Identifierhttp://hdl.handle.net/10722/157088
ISSN
2013 SCImago Journal Rankings: 0.410
References

 

DC FieldValueLanguage
dc.contributor.authorChen, Yen_US
dc.contributor.authorYang, Zen_US
dc.contributor.authorLian, Len_US
dc.date.accessioned2012-08-08T08:45:16Z-
dc.date.available2012-08-08T08:45:16Z-
dc.date.issued2004en_US
dc.identifier.citationComputer-Aided Design And Applications, 2004, v. 1 n. 1-4, p. 577-584en_US
dc.identifier.issn1686-4360en_US
dc.identifier.urihttp://hdl.handle.net/10722/157088-
dc.description.abstractThis paper presents an integrated product development platform. Haptic modeling, due to its growing applications to different aspects of product development, is envisioned as the core technology for the proposed rapid product development platform. Since haptic modeling is developed based on physical laws, it is anticipated as the natural link between the virtual world and practical applications. In the proposed platform, haptic devices are used as the central mechanisms for reverse engineering, shape modeling, virtual prototyping, machining tool path planning and tolerance inspection path planning. The hardware system is constructed by attaching a digitizing probe to a haptic device Phantom®. This configuration enables the force guided digitization in reverse engineering. When a three dimensional computer model is constructed by either haptic shape modeling or reverse engineering, both tool path planning and coordinate measuring machine (CMM) tolerance inspection path planning can be carried out in a haptic environment. Physical models can be made by either computer numerical controlled machining or rapid prototyping machines.en_US
dc.languageengen_US
dc.publisherC A D Solutions. The Journal's web site is located at http://www.cadanda.comen_US
dc.relation.ispartofComputer-Aided Design and Applicationsen_US
dc.subjectHaptic Modelingen_US
dc.subjectProduct Developmenten_US
dc.subjectReverse Engineeringen_US
dc.subjectTool Path Planningen_US
dc.titleHaptic modeling in rapid product developmenten_US
dc.typeArticleen_US
dc.identifier.emailChen, Y:yhchen@hkucc.hku.hken_US
dc.identifier.authorityChen, Y=rp00099en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-78049306669en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-78049306669&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume1en_US
dc.identifier.issue1-4en_US
dc.identifier.spage577en_US
dc.identifier.epage584en_US
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridChen, Y=7601430448en_US
dc.identifier.scopusauthoridYang, Z=7405433286en_US
dc.identifier.scopusauthoridLian, L=8943503200en_US

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