File Download
  • No File Attached
 
Links for fulltext
(May Require Subscription)
 
Supplementary

Article: Haptic modeling in rapid product development
  • Basic View
  • Metadata View
  • XML View
TitleHaptic modeling in rapid product development
 
AuthorsChen, Y1
Yang, Z1
Lian, L1
 
KeywordsHaptic Modeling
Product Development
Reverse Engineering
Tool Path Planning
 
Issue Date2004
 
PublisherC A D Solutions. The Journal's web site is located at http://www.cadanda.com
 
CitationComputer-Aided Design And Applications, 2004, v. 1 n. 1-4, p. 577-584 [How to Cite?]
 
AbstractThis paper presents an integrated product development platform. Haptic modeling, due to its growing applications to different aspects of product development, is envisioned as the core technology for the proposed rapid product development platform. Since haptic modeling is developed based on physical laws, it is anticipated as the natural link between the virtual world and practical applications. In the proposed platform, haptic devices are used as the central mechanisms for reverse engineering, shape modeling, virtual prototyping, machining tool path planning and tolerance inspection path planning. The hardware system is constructed by attaching a digitizing probe to a haptic device Phantom®. This configuration enables the force guided digitization in reverse engineering. When a three dimensional computer model is constructed by either haptic shape modeling or reverse engineering, both tool path planning and coordinate measuring machine (CMM) tolerance inspection path planning can be carried out in a haptic environment. Physical models can be made by either computer numerical controlled machining or rapid prototyping machines.
 
ISSN1686-4360
2013 SCImago Journal Rankings: 0.410
 
ReferencesReferences in Scopus
 
DC FieldValue
dc.contributor.authorChen, Y
 
dc.contributor.authorYang, Z
 
dc.contributor.authorLian, L
 
dc.date.accessioned2012-08-08T08:45:16Z
 
dc.date.available2012-08-08T08:45:16Z
 
dc.date.issued2004
 
dc.description.abstractThis paper presents an integrated product development platform. Haptic modeling, due to its growing applications to different aspects of product development, is envisioned as the core technology for the proposed rapid product development platform. Since haptic modeling is developed based on physical laws, it is anticipated as the natural link between the virtual world and practical applications. In the proposed platform, haptic devices are used as the central mechanisms for reverse engineering, shape modeling, virtual prototyping, machining tool path planning and tolerance inspection path planning. The hardware system is constructed by attaching a digitizing probe to a haptic device Phantom®. This configuration enables the force guided digitization in reverse engineering. When a three dimensional computer model is constructed by either haptic shape modeling or reverse engineering, both tool path planning and coordinate measuring machine (CMM) tolerance inspection path planning can be carried out in a haptic environment. Physical models can be made by either computer numerical controlled machining or rapid prototyping machines.
 
dc.description.natureLink_to_subscribed_fulltext
 
dc.identifier.citationComputer-Aided Design And Applications, 2004, v. 1 n. 1-4, p. 577-584 [How to Cite?]
 
dc.identifier.epage584
 
dc.identifier.issn1686-4360
2013 SCImago Journal Rankings: 0.410
 
dc.identifier.issue1-4
 
dc.identifier.scopuseid_2-s2.0-78049306669
 
dc.identifier.spage577
 
dc.identifier.urihttp://hdl.handle.net/10722/157088
 
dc.identifier.volume1
 
dc.languageeng
 
dc.publisherC A D Solutions. The Journal's web site is located at http://www.cadanda.com
 
dc.publisher.placeUnited States
 
dc.relation.ispartofComputer-Aided Design and Applications
 
dc.relation.referencesReferences in Scopus
 
dc.subjectHaptic Modeling
 
dc.subjectProduct Development
 
dc.subjectReverse Engineering
 
dc.subjectTool Path Planning
 
dc.titleHaptic modeling in rapid product development
 
dc.typeArticle
 
<?xml encoding="utf-8" version="1.0"?>
<item><contributor.author>Chen, Y</contributor.author>
<contributor.author>Yang, Z</contributor.author>
<contributor.author>Lian, L</contributor.author>
<date.accessioned>2012-08-08T08:45:16Z</date.accessioned>
<date.available>2012-08-08T08:45:16Z</date.available>
<date.issued>2004</date.issued>
<identifier.citation>Computer-Aided Design And Applications, 2004, v. 1 n. 1-4, p. 577-584</identifier.citation>
<identifier.issn>1686-4360</identifier.issn>
<identifier.uri>http://hdl.handle.net/10722/157088</identifier.uri>
<description.abstract>This paper presents an integrated product development platform. Haptic modeling, due to its growing applications to different aspects of product development, is envisioned as the core technology for the proposed rapid product development platform. Since haptic modeling is developed based on physical laws, it is anticipated as the natural link between the virtual world and practical applications. In the proposed platform, haptic devices are used as the central mechanisms for reverse engineering, shape modeling, virtual prototyping, machining tool path planning and tolerance inspection path planning. The hardware system is constructed by attaching a digitizing probe to a haptic device Phantom&#174;. This configuration enables the force guided digitization in reverse engineering. When a three dimensional computer model is constructed by either haptic shape modeling or reverse engineering, both tool path planning and coordinate measuring machine (CMM) tolerance inspection path planning can be carried out in a haptic environment. Physical models can be made by either computer numerical controlled machining or rapid prototyping machines.</description.abstract>
<language>eng</language>
<publisher>C A D Solutions. The Journal&apos;s web site is located at http://www.cadanda.com</publisher>
<relation.ispartof>Computer-Aided Design and Applications</relation.ispartof>
<subject>Haptic Modeling</subject>
<subject>Product Development</subject>
<subject>Reverse Engineering</subject>
<subject>Tool Path Planning</subject>
<title>Haptic modeling in rapid product development</title>
<type>Article</type>
<description.nature>Link_to_subscribed_fulltext</description.nature>
<identifier.scopus>eid_2-s2.0-78049306669</identifier.scopus>
<relation.references>http://www.scopus.com/mlt/select.url?eid=2-s2.0-78049306669&amp;selection=ref&amp;src=s&amp;origin=recordpage</relation.references>
<identifier.volume>1</identifier.volume>
<identifier.issue>1-4</identifier.issue>
<identifier.spage>577</identifier.spage>
<identifier.epage>584</identifier.epage>
<publisher.place>United States</publisher.place>
</item>
Author Affiliations
  1. The University of Hong Kong