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Conference Paper: Engineering education outreach in Chinese social context: An ethnographical study on IEEE-TISP implementation with rural schools in Hong Kong

TitleEngineering education outreach in Chinese social context: An ethnographical study on IEEE-TISP implementation with rural schools in Hong Kong
Authors
KeywordsCommunity involvement
Engineering education outreach
Ethnography
IEEE-TISP
Issue Date2010
Citation
Proceedings - Frontiers In Education Conference, Fie, 2010, p. T2E1-T2E6 How to Cite?
AbstractEngineering education outreach at pre-university level has become a recent focus of engineering education. Some initiatives, such as IEEE's Teacher-In-Service Programme (TISP), have been offered by professional organizations to support engineering education outreach for pre-university sectors by professional engineer volunteers. The support being offered consists of a variety of forms, e.g., web-based teaching plans, on-campus support for teachers and on-campus experiment sessions. The resourceful support by professional organizations may be appropriate in the urban area but in fact needs much adaptation and customization in the less privileged rural schools. One issue is to address the cultural differences between the city and rural contexts. While the city schools favor professionalism when promoting the outreach programmes, the rural schools emphasize more on trust and social networks with the local community to foster initial acceptance and whole-community support to the programme. We adopt an ethnography approach to investigate the implementation of IEEE TISP in two rural small schools in the Frontier Closed Area (FCA) along the Hong Kong and Mainland China boundary. Our experience provides a set of best practices for those who plan about engineering education outreach programmes in a rural community especially in China. © 2010 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/134687
ISSN
2023 SCImago Journal Rankings: 0.257
References

 

DC FieldValueLanguage
dc.contributor.authorMark, KPen_HK
dc.contributor.authorTsang, HMen_HK
dc.contributor.authorChan, YYen_HK
dc.date.accessioned2011-07-05T08:24:30Z-
dc.date.available2011-07-05T08:24:30Z-
dc.date.issued2010en_HK
dc.identifier.citationProceedings - Frontiers In Education Conference, Fie, 2010, p. T2E1-T2E6en_HK
dc.identifier.issn1539-4565en_HK
dc.identifier.urihttp://hdl.handle.net/10722/134687-
dc.description.abstractEngineering education outreach at pre-university level has become a recent focus of engineering education. Some initiatives, such as IEEE's Teacher-In-Service Programme (TISP), have been offered by professional organizations to support engineering education outreach for pre-university sectors by professional engineer volunteers. The support being offered consists of a variety of forms, e.g., web-based teaching plans, on-campus support for teachers and on-campus experiment sessions. The resourceful support by professional organizations may be appropriate in the urban area but in fact needs much adaptation and customization in the less privileged rural schools. One issue is to address the cultural differences between the city and rural contexts. While the city schools favor professionalism when promoting the outreach programmes, the rural schools emphasize more on trust and social networks with the local community to foster initial acceptance and whole-community support to the programme. We adopt an ethnography approach to investigate the implementation of IEEE TISP in two rural small schools in the Frontier Closed Area (FCA) along the Hong Kong and Mainland China boundary. Our experience provides a set of best practices for those who plan about engineering education outreach programmes in a rural community especially in China. © 2010 IEEE.en_HK
dc.languageengen_US
dc.relation.ispartofProceedings - Frontiers in Education Conference, FIEen_HK
dc.subjectCommunity involvementen_HK
dc.subjectEngineering education outreachen_HK
dc.subjectEthnographyen_HK
dc.subjectIEEE-TISPen_HK
dc.titleEngineering education outreach in Chinese social context: An ethnographical study on IEEE-TISP implementation with rural schools in Hong Kongen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailChan, YY: yychan8@hkucc.hku.hken_HK
dc.identifier.authorityChan, YY=rp00894en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/FIE.2010.5673621en_HK
dc.identifier.scopuseid_2-s2.0-84988306334en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-78751510682&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.spageT2E1en_HK
dc.identifier.epageT2E6en_HK
dc.identifier.scopusauthoridMark, KP=36809900800en_HK
dc.identifier.scopusauthoridTsang, HM=36810766400en_HK
dc.identifier.scopusauthoridChan, YY=7403676264en_HK
dc.identifier.issnl1539-4565-

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