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Article: Robust simulation methodology for surface-roughness loss in interconnect and package modelings
Title | Robust simulation methodology for surface-roughness loss in interconnect and package modelings | ||||||
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Authors | |||||||
Keywords | Interconnect Power loss Rough surface Scalar-wave modeling (SWM) Spectral stochastic collocation | ||||||
Issue Date | 2009 | ||||||
Publisher | IEEE. | ||||||
Citation | Ieee Transactions On Computer-Aided Design Of Integrated Circuits And Systems, 2009, v. 28 n. 11, p. 1654-1665 How to Cite? | ||||||
Abstract | In multigigahertz integrated-circuit design, the extra energy loss caused by conductor surface roughness in metallic interconnects and packagings is more evident than ever before and demands explicit consideration for accurate prediction of signal integrity and energy consumption. Existing techniques based on analytical approximation, despite simple formulations, suffer from restrictive valid ranges, namely, either small or large roughness/frequencies. In this paper, we propose a robust and efficient numerical-simulation methodology applicable to evaluating general surface roughness, described by parameterized stochastic processes, across a wide frequency band. Traditional computation-intensive electromagnetic simulation is avoided via a tailored scalar-wave modeling to capture the power loss due to surface roughness. The spectral stochastic collocation method is applied to construct the complete statistical model. Comparisons with full wave simulation as well as existing methods in their respective valid ranges then verify the effectiveness of the proposed approach. © 2009 IEEE. | ||||||
Persistent Identifier | http://hdl.handle.net/10722/129192 | ||||||
ISSN | 2023 Impact Factor: 2.7 2023 SCImago Journal Rankings: 0.957 | ||||||
ISI Accession Number ID |
Funding Information: Manuscript received January 30, 2009; revised April 23, 2009, June 8, 2009, and July 23, 2009. Current version published October 21, 2009. This work was supported in part by the Hong Kong Research Grants Council under Project HKU 717407E and in part by the University Research Committee of The University of Hong Kong. This paper was recommended by Associate Editor P. Li. | ||||||
References | |||||||
Grants |
DC Field | Value | Language |
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dc.contributor.author | Chen, Q | en_HK |
dc.contributor.author | Choi, HW | en_HK |
dc.contributor.author | Wong, N | en_HK |
dc.date.accessioned | 2010-12-23T08:33:29Z | - |
dc.date.available | 2010-12-23T08:33:29Z | - |
dc.date.issued | 2009 | en_HK |
dc.identifier.citation | Ieee Transactions On Computer-Aided Design Of Integrated Circuits And Systems, 2009, v. 28 n. 11, p. 1654-1665 | en_HK |
dc.identifier.issn | 0278-0070 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/129192 | - |
dc.description.abstract | In multigigahertz integrated-circuit design, the extra energy loss caused by conductor surface roughness in metallic interconnects and packagings is more evident than ever before and demands explicit consideration for accurate prediction of signal integrity and energy consumption. Existing techniques based on analytical approximation, despite simple formulations, suffer from restrictive valid ranges, namely, either small or large roughness/frequencies. In this paper, we propose a robust and efficient numerical-simulation methodology applicable to evaluating general surface roughness, described by parameterized stochastic processes, across a wide frequency band. Traditional computation-intensive electromagnetic simulation is avoided via a tailored scalar-wave modeling to capture the power loss due to surface roughness. The spectral stochastic collocation method is applied to construct the complete statistical model. Comparisons with full wave simulation as well as existing methods in their respective valid ranges then verify the effectiveness of the proposed approach. © 2009 IEEE. | en_HK |
dc.language | eng | en_US |
dc.publisher | IEEE. | - |
dc.relation.ispartof | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems | en_HK |
dc.rights | ©2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. | - |
dc.subject | Interconnect | en_HK |
dc.subject | Power loss | en_HK |
dc.subject | Rough surface | en_HK |
dc.subject | Scalar-wave modeling (SWM) | en_HK |
dc.subject | Spectral stochastic collocation | en_HK |
dc.title | Robust simulation methodology for surface-roughness loss in interconnect and package modelings | en_HK |
dc.type | Article | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0278-0070&volume=28&issue=11&spage=1654&epage=1665&date=2009&atitle=Robust+simulation+methodology+for+surface-roughness+loss+in+interconnect+and+package+modelings | - |
dc.identifier.email | Chen, Q: q1chen@hku.hk | en_HK |
dc.identifier.email | Choi, HW: hwchoi@hku.hk | en_HK |
dc.identifier.email | Wong, N: nwong@eee.hku.hk | en_HK |
dc.identifier.authority | Chen, Q=rp01688 | en_HK |
dc.identifier.authority | Choi, HW=rp00108 | en_HK |
dc.identifier.authority | Wong, N=rp00190 | en_HK |
dc.description.nature | published_or_final_version | - |
dc.identifier.doi | 10.1109/TCAD.2009.2030408 | en_HK |
dc.identifier.scopus | eid_2-s2.0-70350576860 | en_HK |
dc.identifier.hkuros | 177854 | en_US |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-70350576860&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 28 | en_HK |
dc.identifier.issue | 11 | en_HK |
dc.identifier.spage | 1654 | en_HK |
dc.identifier.epage | 1665 | en_HK |
dc.identifier.isi | WOS:000271019800004 | - |
dc.publisher.place | United States | en_HK |
dc.relation.project | Versatile Model Order Reduction of Frequency-Dependent VLSI Interconnect Models | - |
dc.identifier.scopusauthorid | Chen, Q=18133382800 | en_HK |
dc.identifier.scopusauthorid | Choi, HW=7404334877 | en_HK |
dc.identifier.scopusauthorid | Wong, N=35235551600 | en_HK |
dc.identifier.issnl | 0278-0070 | - |