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Article: Robust simulation methodology for surface-roughness loss in interconnect and package modelings

TitleRobust simulation methodology for surface-roughness loss in interconnect and package modelings
Authors
KeywordsInterconnect
Power loss
Rough surface
Scalar-wave modeling (SWM)
Spectral stochastic collocation
Issue Date2009
PublisherIEEE.
Citation
Ieee Transactions On Computer-Aided Design Of Integrated Circuits And Systems, 2009, v. 28 n. 11, p. 1654-1665 How to Cite?
AbstractIn multigigahertz integrated-circuit design, the extra energy loss caused by conductor surface roughness in metallic interconnects and packagings is more evident than ever before and demands explicit consideration for accurate prediction of signal integrity and energy consumption. Existing techniques based on analytical approximation, despite simple formulations, suffer from restrictive valid ranges, namely, either small or large roughness/frequencies. In this paper, we propose a robust and efficient numerical-simulation methodology applicable to evaluating general surface roughness, described by parameterized stochastic processes, across a wide frequency band. Traditional computation-intensive electromagnetic simulation is avoided via a tailored scalar-wave modeling to capture the power loss due to surface roughness. The spectral stochastic collocation method is applied to construct the complete statistical model. Comparisons with full wave simulation as well as existing methods in their respective valid ranges then verify the effectiveness of the proposed approach. © 2009 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/129192
ISSN
2015 Impact Factor: 1.181
2015 SCImago Journal Rankings: 0.710
ISI Accession Number ID
Funding AgencyGrant Number
Hong Kong Research Grants CouncilHKU 717407E
University Research Committee of The University of Hong Kong.
Funding Information:

Manuscript received January 30, 2009; revised April 23, 2009, June 8, 2009, and July 23, 2009. Current version published October 21, 2009. This work was supported in part by the Hong Kong Research Grants Council under Project HKU 717407E and in part by the University Research Committee of The University of Hong Kong. This paper was recommended by Associate Editor P. Li.

References
Grants

 

DC FieldValueLanguage
dc.contributor.authorChen, Qen_HK
dc.contributor.authorChoi, HWen_HK
dc.contributor.authorWong, Nen_HK
dc.date.accessioned2010-12-23T08:33:29Z-
dc.date.available2010-12-23T08:33:29Z-
dc.date.issued2009en_HK
dc.identifier.citationIeee Transactions On Computer-Aided Design Of Integrated Circuits And Systems, 2009, v. 28 n. 11, p. 1654-1665en_HK
dc.identifier.issn0278-0070en_HK
dc.identifier.urihttp://hdl.handle.net/10722/129192-
dc.description.abstractIn multigigahertz integrated-circuit design, the extra energy loss caused by conductor surface roughness in metallic interconnects and packagings is more evident than ever before and demands explicit consideration for accurate prediction of signal integrity and energy consumption. Existing techniques based on analytical approximation, despite simple formulations, suffer from restrictive valid ranges, namely, either small or large roughness/frequencies. In this paper, we propose a robust and efficient numerical-simulation methodology applicable to evaluating general surface roughness, described by parameterized stochastic processes, across a wide frequency band. Traditional computation-intensive electromagnetic simulation is avoided via a tailored scalar-wave modeling to capture the power loss due to surface roughness. The spectral stochastic collocation method is applied to construct the complete statistical model. Comparisons with full wave simulation as well as existing methods in their respective valid ranges then verify the effectiveness of the proposed approach. © 2009 IEEE.en_HK
dc.languageengen_US
dc.publisherIEEE.-
dc.relation.ispartofIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systemsen_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License-
dc.rightsIEEE Transactions on Computer - Aided Design of Integrated Circuits and Systems. Copyright © IEEE.-
dc.rights©2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.-
dc.subjectInterconnecten_HK
dc.subjectPower lossen_HK
dc.subjectRough surfaceen_HK
dc.subjectScalar-wave modeling (SWM)en_HK
dc.subjectSpectral stochastic collocationen_HK
dc.titleRobust simulation methodology for surface-roughness loss in interconnect and package modelingsen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0278-0070&volume=28&issue=11&spage=1654&epage=1665&date=2009&atitle=Robust+simulation+methodology+for+surface-roughness+loss+in+interconnect+and+package+modelings-
dc.identifier.emailChen, Q: q1chen@hku.hken_HK
dc.identifier.emailChoi, HW: hwchoi@hku.hken_HK
dc.identifier.emailWong, N: nwong@eee.hku.hken_HK
dc.identifier.authorityChen, Q=rp01688en_HK
dc.identifier.authorityChoi, HW=rp00108en_HK
dc.identifier.authorityWong, N=rp00190en_HK
dc.description.naturepublished_or_final_version-
dc.identifier.doi10.1109/TCAD.2009.2030408en_HK
dc.identifier.scopuseid_2-s2.0-70350576860en_HK
dc.identifier.hkuros177854en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-70350576860&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume28en_HK
dc.identifier.issue11en_HK
dc.identifier.spage1654en_HK
dc.identifier.epage1665en_HK
dc.identifier.isiWOS:000271019800004-
dc.publisher.placeUnited Statesen_HK
dc.relation.projectVersatile Model Order Reduction of Frequency-Dependent VLSI Interconnect Models-
dc.identifier.scopusauthoridChen, Q=18133382800en_HK
dc.identifier.scopusauthoridChoi, HW=7404334877en_HK
dc.identifier.scopusauthoridWong, N=35235551600en_HK

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