Showing results 1 to 2 of 2
| Title | Author(s) | Issue Date | Views | |
|---|---|---|---|---|
Fundamentals and improvements of diffusion barrier/copper adhesion for damascene process Proceeding/Conference:Advanced Metallization Conference (AMC) | 2001 | 5 | ||
TDDB reliability improvement in Cu damascene by using a bilayer-structured PECVD SiC dielectric barrier Proceeding/Conference:Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002 | 2002 |