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Title | Author(s) | Issue Date | |
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Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method Journal:IEEE Transactions on Components, Packaging and Manufacturing Technology | 2017 |
Title | Author(s) | Issue Date | |
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Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method Journal:IEEE Transactions on Components, Packaging and Manufacturing Technology | 2017 |