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- Publisher Website: 10.1109/TCPMT.2017.2666259
- Scopus: eid_2-s2.0-85016496903
- WOS: WOS:000402736000006
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Article: Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method
Title | Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method |
---|---|
Authors | |
Keywords | Auxiliary-differential equation (ADE) method discontinuous Galerkin time-domain (DGTD) method integrated circuit package numerical flux transient thermal analysis |
Issue Date | 2017 |
Publisher | IEEE. The Journal's web site is located at http://cpmt.ieee.org/transactions-on-cpmt.html |
Citation | IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, v. 7, p. 862-871 How to Cite? |
Persistent Identifier | http://hdl.handle.net/10722/247416 |
ISSN | 2023 Impact Factor: 2.3 2023 SCImago Journal Rankings: 0.562 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Li, P | - |
dc.contributor.author | Dong, YILIN | - |
dc.contributor.author | Tang, MIN | - |
dc.contributor.author | Mao, JUNFA | - |
dc.contributor.author | Jiang, L | - |
dc.contributor.author | Bagci, HAKAN | - |
dc.date.accessioned | 2017-10-18T08:26:54Z | - |
dc.date.available | 2017-10-18T08:26:54Z | - |
dc.date.issued | 2017 | - |
dc.identifier.citation | IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, v. 7, p. 862-871 | - |
dc.identifier.issn | 2156-3950 | - |
dc.identifier.uri | http://hdl.handle.net/10722/247416 | - |
dc.language | eng | - |
dc.publisher | IEEE. The Journal's web site is located at http://cpmt.ieee.org/transactions-on-cpmt.html | - |
dc.relation.ispartof | IEEE Transactions on Components, Packaging and Manufacturing Technology | - |
dc.rights | IEEE Transactions on Components, Packaging and Manufacturing Technology. Copyright © IEEE. | - |
dc.rights | ©20xx IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | - |
dc.subject | Auxiliary-differential equation (ADE) method | - |
dc.subject | discontinuous Galerkin time-domain (DGTD) method | - |
dc.subject | integrated circuit package | - |
dc.subject | numerical flux | - |
dc.subject | transient thermal analysis | - |
dc.title | Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method | - |
dc.type | Article | - |
dc.identifier.email | Li, P: liping@eee.hku.hk | - |
dc.identifier.email | Jiang, L: jianglj@hku.hk | - |
dc.identifier.authority | Li, P=rp02237 | - |
dc.identifier.authority | Jiang, L=rp01338 | - |
dc.identifier.doi | 10.1109/TCPMT.2017.2666259 | - |
dc.identifier.scopus | eid_2-s2.0-85016496903 | - |
dc.identifier.hkuros | 280750 | - |
dc.identifier.volume | 7 | - |
dc.identifier.spage | 862 | - |
dc.identifier.epage | 871 | - |
dc.identifier.isi | WOS:000402736000006 | - |
dc.publisher.place | United States | - |
dc.identifier.issnl | 2156-3950 | - |